Laminated Structure Foreign Matter Removal via Mask Etching
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Solution Overview
Problem
Existing methods for manufacturing laminated structures and liquid ejection head substrates struggle to effectively suppress the influence of foreign matter present on the substrate, especially when such matter is randomly generated and not limited to specific locations, leading to potential corrosion and defects during processing.
Innovation Solution
A method involving the formation of a mask layer on the substrate surface, followed by etching treatment to remove foreign matter in the height direction, ensuring that no foreign matter is exposed after forming the second layer, which can be a film forming layer or a barrier metal layer, thereby preventing corrosion and defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a barrier metal layer or Au layer is formed on the wiring layer to prevent foreign matter exposure, then corrosion resistance is improved, but foreign matter randomly generated on the wiring layer surface cannot be completely covered and may still be exposed
Solution Approach 1:
The patent applies preliminary action by forming a mask layer on the wiring layer surface before forming the barrier metal layer or Au layer. This mask layer is subsequently removed through etching treatment, creating a recess that allows the second layer to fully cover any foreign matter present on the wiring layer surface, ensuring complete coverage and preventing exposure of foreign matter during subsequent processing
Solution Approach 2:
The mask layer serves as an intermediary element in the patent. It is formed on the wiring layer, has foreign matter removed from its surface through etching treatment, and then serves as a template for forming the second layer. This intermediary structure enables the second layer to conformally cover the wiring layer surface and any embedded foreign matter, achieving complete coverage without directly contacting the foreign matter
2Reliability
If the wiring layer is removed to form an opening region to prevent Au diffusion, then Au diffusion is prevented, but foreign matter randomly generated on the wiring layer cannot be suppressed
Solution Approach 1:
The patent applies preliminary action by forming a mask layer on the wiring layer surface before removing the wiring layer to create the opening region. This mask layer is subsequently removed through etching treatment, creating a recess that allows the second layer to fully cover any foreign matter present on the wiring layer surface, ensuring complete coverage and preventing exposure of foreign matter during subsequent processing
Solution Approach 2:
The mask layer serves as an intermediary element in the patent. It is formed on the wiring layer, has foreign matter removed from its surface through etching treatment, and then serves as a template for forming the second layer. This intermediary structure enables the second layer to conformally cover the wiring layer surface and any embedded foreign matter, achieving complete coverage without directly contacting the foreign matter
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the effective removal and suppression of foreign matter regardless of its location, preventing corrosion and ensuring the integrity of the laminated structure and liquid ejection head substrates by ensuring the foreign matter is covered and not exposed after the second layer is formed.
Implementation Method 1
removing at least a part of the foreign matter in a height direction by performing an etching treatment on the entire surface of the mask layer
Data Source
AI summary
A method for manufacturing a laminated structure, or a method for manufacturing a liquid ejection head substrate having an electrode pad, including: preparing a substrate on which a first layer is formed, foreign matter being present on a surface of the first layer; forming a mask layer on an entire area of a surface of the substrate, the surface of the substrate being provided with the first layer; removing at least a part of the foreign matter in a height direction by performing an etching treatment on the entire surface of the mask layer; and forming a second layer on a surface on which the etching treatment is performed, wherein the etching treatment is performed so that the foreign matter is not exposed from the second layer after forming the second layer.