Laminated Structure Thermal Stress Protection
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Solution Overview
Problem
Conventional insert molding techniques often result in damage to electrically conductive layers due to thermal expansion and mechanical stress, leading to cracks and deformation in electronic devices, especially when exposed to high temperatures.
Innovation Solution
A laminated structure comprising an electrically conductive layer, an underlying layer with a first resin and inorganic particles, and a resin layer with a third resin having a softening temperature equal to or lower than the second resin, which reduces thermal expansion and mechanical stress on the conductive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional insert molding is used to produce electronic devices with electrically conductive layers, then productivity is improved, but the electrically conductive layer suffers thermal expansion damage and cracking when exposed to high temperatures
Solution Approach 1:
The patent changes the material parameters of the underlying layer by incorporating inorganic particles with low thermal expansion coefficients (such as silica, alumina, or barium sulfate) to reduce the overall thermal expansion of the layer. This parameter modification allows the electrically conductive layer to withstand thermal stress during high-temperature operations without cracking or deforming, thereby resolving the contradiction between maintaining productivity through insert molding and ensuring reliability under thermal conditions.
Solution Approach 2:
The patent creates a composite underlying layer combining organic resin matrix with inorganic particles to achieve both processability and thermal stability. This composite structure provides mechanical support for the electrically conductive layer while the inorganic particles suppress thermal expansion, preventing damage during high-temperature operations and maintaining the integrity of the conductive layer throughout the device lifecycle.
2Ease of manufacture
If the underlying layer uses only organic resin, then manufacturing is simple, but thermal expansion causes stress and cracks in the electrically conductive layer at high temperatures
Solution Approach 1:
The patent employs a composite underlying layer structure where inorganic particles (such as silica, alumina, or barium sulfate) are dispersed within an organic resin matrix. This composite design maintains the ease of manufacture advantage of organic resins while adding thermal expansion suppression through the inorganic particles, thereby reducing stress on the electrically conductive layer during high-temperature operations and preventing crack formation.
Solution Approach 2:
The patent applies local quality enhancement by concentrating inorganic particles specifically in the underlying layer that contacts the electrically conductive layer. This localized modification provides thermal expansion suppression exactly where needed to protect the conductive layer from stress, while other parts of the structure maintain their original properties for ease of manufacture.
3Stability of the object's composition
If a resin layer with high softening temperature is used, then structural stability is improved, but manufacturing difficulty increases due to processing constraints
Solution Approach 1:
The patent optimizes the softening temperature parameter of the resin layer to a specific range (80°C to 150°C) that balances structural stability and manufacturability. This parameter adjustment allows the resin layer to maintain sufficient stability during normal operation while enabling easier processing during manufacturing, as the lower softening temperature facilitates molding and assembly operations without requiring excessive energy or specialized equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively prevents damage to the electrically conductive layer by minimizing thermal deformation and stress, ensuring the layer's integrity and performance, even in high-temperature environments.
Implementation Method 1
the electrically conductive layer, the underlying layer, the support, and the resin layer are disposed in this order... an underlying layer including a first resin and inorganic particles
Implementation Method 2
a resin layer including a third resin that is at least one selected from the group consisting of a resin of same kind as the second resin and a resin having a softening temperature equal to or lower than a softening temperature of the second resin
Data Source
AI summary
A laminated structure including: an electrically conductive layer; an underlying layer including a first resin and inorganic particles; a support including a second resin; and a resin layer including a third resin that is at least one selected from the group consisting of a resin of same kind as the second resin and a resin having a softening temperature equal to or lower than a softening temperature of the second resin, the electrically conductive layer, the underlying layer, the support, and the resin layer being disposed in this order.