Laminated Substrate Edge Measurement for 3D Alignment Correction
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in accurately determining the position and alignment of misaligned substrates during the lamination of semiconductor devices, leading to reduced manufacturing yield and potential contamination in the facility.
Innovation Solution
A semiconductor manufacturing apparatus is equipped with a rotatable substrate stage and two measuring mechanisms that measure the edges of substrates from different angles, providing three-dimensional information to accurately calculate the center positions of misaligned substrates, thereby improving alignment precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single measuring mechanism is used to measure substrate edges, then the device complexity is reduced, but the measurement precision and alignment accuracy deteriorate
Solution Approach 1:
The patent transitions from single-direction (one-dimensional) edge measurement to multi-directional (three-dimensional) edge measurement by adding a second measuring mechanism that measures edges from a different angular direction. This dimensional expansion enables accurate determination of substrate center positions even when substrates are misaligned, directly resolving the measurement precision issue without excessive complexity increase.
Solution Approach 2:
The measurement function is segmented into two independent measuring mechanisms, each responsible for measuring substrate edges from different directions. This segmentation allows each mechanism to be optimized for its specific measurement direction while collectively providing comprehensive three-dimensional positioning information, balancing measurement precision with device complexity.
2Productivity
If misaligned substrates are processed without accurate position determination, then the manufacturing process is simplified, but the manufacturing yield deteriorates
Solution Approach 1:
The system implements feedback by using the measured edge positions from multiple measuring mechanisms to calculate and determine the actual center positions of misaligned substrates. This feedback loop enables real-time correction and accurate positioning, allowing the manufacturing process to adapt to substrate misalignment and maintain high manufacturing yield without sacrificing precision.
3Reliability
If substrate position is not accurately determined, then the processing time is reduced, but contamination risks increase
Solution Approach 1:
The system performs preliminary measurement of substrate edge positions using multiple measuring mechanisms before the actual manufacturing process. By determining substrate center positions and alignment status in advance, the system enables proactive correction and positioning, preventing contamination risks before they occur while minimizing time loss through efficient pre-positioning.
Data Source
AI summary
According to one embodiment, there is provided a semiconductor manufacturing apparatus including a rotatable substrate stage, a first measuring mechanism and a second measuring mechanism. On the rotatable substrate stage, a laminated substrate used for manufacturing a semiconductor device is placed. The laminated substrate is formed by a first substrate and a second substrate to be laminated to each other. The first measuring mechanism measures an edge of the first substrate and an edge of the second substrate from a first direction. The second measuring mechanism measures the edge of the first substrate and the edge of the second substrate from a second direction. The second direction is a direction different from the first direction in an angle to a normal of the first substrate.