Laminated Substrate Edge Filling to Prevent Chipping During Thinning
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Solution Overview
Problem
In three-dimensional packaging technology, the formation of acute edges during substrate grinding leads to chipping and cracking of laminated substrates, and insufficient bonding between substrates exacerbates these issues during thinning processes.
Innovation Solution
A substrate processing method involving the application and curing of a thermosetting filler in the gaps between substrates, using a syringe mechanism, ejection mechanism, or conveyance mechanism, and curing with a lamp heater or heat-gun to strengthen the bond and protect the edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the circumferential surface of the substrate is polished in a rounded shape to prevent cracking or chipping, then the substrate surface quality is improved, but an acute edge (knife-edge portion) is formed on the grinded back surface which is likely to be chipped
Solution Approach 1:
The patent applies filler material to the gap between substrates before the grinding process occurs. This preliminary action ensures that when the back surface is grinded and knife-edge portions form, the filler already provides protective support at the peripheral portions, preventing chipping of the acute edges that would otherwise occur
Solution Approach 2:
The filler material acts as an intermediary substance between the first substrate and second substrate. It fills the gap and provides mechanical support to the peripheral portions, particularly protecting the grinded back surface from forming vulnerable knife-edge portions that would be prone to chipping
2Adaptability or versatility
If multiple substrates are bonded together to achieve higher density and functionality, then the device capability is improved, but insufficient bonding causes cracking during grinding and the laminated substrate may break during transportation
Solution Approach 1:
The filler material serves as an intermediary that reinforces the bonding interface between multiple substrates. By filling the gap and curing to form a solid structure, it creates additional mechanical support that prevents cracking during grinding and protects against breakage during transportation, thereby improving the reliability of the laminated substrate structure
Solution Approach 2:
The patent creates a composite structure by combining multiple substrates with filler material in the gaps between them. This composite construction provides both the functional benefits of multiple substrates and the structural reinforcement needed to prevent cracking and breakage, achieving higher reliability while maintaining device capability
3Manufacturing precision
If the second substrate is thinned by polishing or grinding after bonding, then the device integration is improved, but the knife-edge portion formed is vulnerable to chipping and the substrate may crack
Solution Approach 1:
The filler is applied and cured before the thinning process begins. This preliminary reinforcement of the peripheral portions and gap regions provides structural support during the subsequent grinding operation, preventing the formation of vulnerable knife-edge portions and avoiding cracks that would occur without this prior reinforcement
Solution Approach 2:
The cured filler material provides beforehand cushioning and support to the peripheral portions of the substrates. During the thinning process, this pre-established structural reinforcement absorbs and distributes stresses that would otherwise cause cracking or chipping of the knife-edge portions formed on the grinded surfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cured filler enhances the strength of the laminated substrate, effectively suppressing cracking and chipping during thinning and transportation by supporting the peripheral edges, thereby improving the substrate's integrity.
Implementation Method 1
the lamp heater irradiates a light having a wavelength of 1 μm or more from above or below the laminated substrate toward the filler
Implementation Method 2
applying a filler, having thermosetting property, to a gap between a peripheral portion of the first substrate and a peripheral portion of the second substrate
Implementation Method 3
curing the filler comprises curing the filler by use of a heat-gun
Data Source
AI summary
The present application relates to a substrate processing method for suppressing cracking and chipping of a laminated substrate manufactured by bonding a plurality of substrates. Further, the present application relates to a substrate processing apparatus capable of performing such a substrate processing method. The present method includes: rotating a laminated substrate manufactured by bonding a first substrate and a second substrate; applying a filler, having thermosetting property, to a gap between a peripheral portion of the first substrate and a peripheral portion of the second substrate; and curing the filler. Applying the filler and curing the filler are continuously performed in a same processing chamber.