Laminated Substrate Filler Shielding Against Splash Contamination
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Solution Overview
Problem
Existing filler-application modules risk contaminating the upper and lower surfaces of laminated substrates with liquid splashes of filler, which can adversely affect subsequent processing and decrease device yield.
Innovation Solution
A filler-application apparatus with a protector mechanism that includes a plate or dome to prevent liquid splashes from reaching the substrate surfaces, using materials that can adsorb the filler or are coated with such materials, and incorporating suction nozzles to collect filler droplets, ensuring the apparatus applies filler to gaps between substrate edges without contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the filler is injected from an application module separated from the laminated substrate, then the filler can be applied to the gap between substrates, but liquid splashes of the filler may collide with the substrate surfaces and cause contamination
Solution Approach 1:
A protector is introduced as an intermediary component between the application module and the laminated substrate. The protector intercepts liquid splashes of filler before they reach the substrate surfaces, allowing the filler application process to continue while preventing contamination. The protector acts as a mediator that separates the harmful effect (liquid splashes) from the vulnerable object (substrate surfaces).
Solution Approach 2:
The protector is positioned and configured to prevent liquid splashes from reaching the substrate surfaces before contamination can occur. By placing the protector in advance in the potential path of liquid splashes, the system proactively counteracts the harmful effect before it affects the substrate, rather than attempting to clean or remove contamination after it occurs.
2Ease of operation
If the application module is located away from the laminated substrate, then the filler can be injected toward the gap, but the filler may scatter and contaminate the substrate surfaces
Solution Approach 1:
The protector serves as an intermediary that enables the application module to be positioned away from the substrate while preventing the harmful scattering of filler from reaching the substrate surfaces. This intermediary component allows the beneficial separation (ease of operation) to be maintained while blocking the harmful effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protector mechanism effectively prevents filler splashes from contaminating the substrate surfaces, maintaining cleanliness and enhancing the yield of subsequent processing by reducing contamination risks.
Implementation Method 1
incorporating suction nozzles to collect filler droplets
Implementation Method 2
using materials that can adsorb the filler
Data Source
AI summary
The present application relates to a filler-application apparatus for applying a filler to a gap formed between edge portions of a plurality of substrates that constitute a laminated substrate. The filler-application apparatus includes: a substrate holder configured to hold and rotate a laminated substrate manufactured by bonding a first substrate and a second substrate; an application device located away from the laminated wafer held by the substrate holder, and configured to inject a filler toward a gap formed between a peripheral portion of the first substrate and a peripheral portion of the second substrate; and a protector configured to prevent liquid splashes of the filler, which occur when the filler injected from the application device collides with the gap, from coming into contact with an upper surface and/or a lower surface of the laminated substrate.