Laminated Substrate Hole Diameter Control via By-Product Deposition
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Solution Overview
Problem
Existing laminated substrates used in liquid discharge heads, such as inkjet printers, face challenges in maintaining a consistent hole diameter at the boundary between the silicon substrate and the silicon oxide film, leading to increased flow resistance and unstable liquid discharge.
Innovation Solution
A laminated substrate is designed with a silicon substrate and a silicon compound film, where the silicon compound film has a through hole and the silicon substrate has a corresponding hole communicating with it. The diameter of the hole in the silicon substrate is smaller at least at a portion in the depth direction than the diameter of the through hole on the surface, and a by-product is generated and attached to the sidewall during manufacturing, which is then removed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a through hole is formed in the silicon compound film and a hole is formed in the silicon substrate, then liquid discharge is enabled, but the hole diameter changes at the boundary between the silicon substrate and silicon compound film, increasing flow resistance
Solution Approach 1:
The patent converts the harmful effect of by-product deposition into a beneficial feature. The by-product generated during etching the silicon compound film is intentionally allowed to deposit on the sidewall, and this deposition is used to control and stabilize the hole diameter at the boundary interface, thereby reducing flow resistance and improving liquid discharge stability
Solution Approach 2:
The patent utilizes parameter changes in the etching process to control by-product generation. By adjusting etching conditions (such as using CF4 gas instead of C4F8 gas), the amount and characteristics of by-products are changed, allowing them to deposit in a controlled manner on the sidewall to achieve desired hole diameter consistency at the boundary
2Loss of energy
If the hole diameter is made smaller in the silicon substrate, then flow resistance is reduced, but manufacturing precision becomes more difficult to control
Solution Approach 1:
The patent employs self-service by allowing the etching process itself to generate and deposit by-products that automatically adjust and control the hole diameter at the boundary. The by-product deposition occurs naturally during the etching process without requiring additional control steps, enabling the system to self-regulate the hole dimensions while maintaining manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration suppresses changes in the hole diameter at the boundary, reducing flow resistance and stabilizing liquid discharge, thereby improving the printing quality and ink-refilling performance of the liquid discharge head.
Implementation Method 1
a by-product is generated in the forming the through hole, a portion of the by-product being attached to a sidewall of the through hole in the silicon compound film
Data Source
AI summary
A laminated substrate includes a silicon substrate, and a silicon compound film stacked on the silicon substrate, wherein the silicon compound film has a through hole, wherein the silicon substrate has a hole communicating with the through hole, and wherein a diameter of the hole is smaller at least at a portion in a depth direction of the hole than a diameter of the through hole on a surface in contact with the silicon substrate.