Laminated Substrate Separation via Misaligned Edge Pressing
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Solution Overview
Problem
The challenge lies in effectively separating laminated substrates, where a rigid carrier substrate and a flexible substrate are misaligned at one edge, making complete separation difficult due to strong adhesion, which complicates the fabrication and handling of electronic devices.
Innovation Solution
A laminated substrate separating device and method that utilize a base with a movable separating tool and vacuum/pneumatic units to create a gap between the substrates by pressing against the misaligned edge, allowing the tool to insert and separate them, with the vacuum unit fixing the second substrate to a roller for curling and separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the flexible substrate is attached closely to the rigid carrier substrate through an adhesion layer to avoid substrate displacement during fabrication, then the substrate stability is improved, but the separation difficulty increases
Solution Approach 1:
The patent introduces a releasing layer between the flexible substrate and rigid carrier substrate before fabrication. This releasing layer is designed to be removable after fabrication, allowing easy separation of the substrates. The releasing layer is applied in advance (preliminary action) to enable future separation without compromising the strong adhesion needed during fabrication.
Solution Approach 2:
The releasing layer acts as an intermediary between the flexible substrate and rigid carrier substrate. During fabrication, it allows strong adhesion for stability, but can be removed to enable separation. This intermediary layer resolves the contradiction by providing different functions at different stages: stability during fabrication and separability after fabrication.
2Ease of operation
If a conventional roller and mechanical arm are used to transport the laminated substrate, then the handling capability is improved, but the device complexity increases
Solution Approach 1:
The patent extracts the flexible substrate from the rigid carrier substrate after fabrication by removing the releasing layer. This allows the flexible substrate to be handled separately using simpler methods appropriate for flexible substrates, rather than requiring complex equipment designed for rigid substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables simple and complete separation of the substrates, overcoming the adhesion challenge and facilitating the handling and processing of flexible substrates in electronic device fabrication.
Implementation Method 1
the vacuum unit produces a vacuum-absorbing effect to the second substrate
Data Source
AI summary
A laminated substrate separating device used for separating a first substrate from a second substrate of a laminated substrate is provided. The first and the second substrates are misaligned at an edge of the laminated substrate. The laminated substrate separating device includes a base where the laminated substrate is disposed thereon, and a separating tool movably disposed on the base along an axis. The separating tool presses a portion of the first substrate being exposed out of the second substrate at a misaligned edge such that a gap is formed between the first and the second substrates. The separating tool inserts into the gap at the misaligned edge to press the first substrate, such that the second substrate is separated from the first substrate. A method for separating laminated substrate is also provided.