Laminated Wafer Resin Alignment to Prevent Chip Sidewall Contamination
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Solution Overview
Problem
The existing methods for manufacturing laminated device chips result in gaps between stacked device chips, leading to foreign matter adhesion on the side surfaces, necessitating a process to remove adhered insulator or metal residues.
Innovation Solution
A method involving the formation of grooves and resin layers in wafers to cover the side surfaces of device chips, followed by thinning and laminating the wafers to align resin layers for stacking, and cutting the resin layers to form laminated device chips without damaging the wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wafers are thinned and divided by forming grooves and grinding from the top surface side, then wafer damage is reduced during division, but gaps are formed between adjacent laminated device chips
Solution Approach 1:
The patent applies preliminary action by forming grooves and filling them with resin layers before the wafer thinning and division processes. This preliminary preparation ensures that when the wafer is later divided into device chips, the resin layers remain in place to fill and cover the gaps between adjacent chips, preventing gap formation while maintaining the benefits of the groove-based division method.
2Productivity
If device chips are stacked to form laminated device chips, then miniaturization and higher density are achieved, but foreign matter adheres to the side surfaces facing gaps
Solution Approach 1:
The patent applies the taking out principle by removing the harmful effect of gap exposure through resin layer coverage. The resin layers are formed to extend beyond the wafer surfaces and cover the side surfaces of device chips in the stacked configuration, effectively extracting or eliminating the gap region where foreign matter would otherwise adhere, thus preventing contamination while maintaining high-density stacking.
Solution Approach 2:
The resin layers serve as intermediary materials between adjacent device chips in the laminated structure. These resin layers fill the gaps and cover the side surfaces, acting as a protective barrier that prevents foreign matter from adhering to the chip side surfaces while allowing the chips to maintain their electrical and functional independence.
3Object-affected harmful factors
If grooves are formed to the finished thickness depth, then resin layers can cover side surfaces, but additional processing steps are required
Solution Approach 1:
The patent merges multiple functions into the resin layer formation process. The resin layers are formed to simultaneously fill the grooves, cover the side surfaces of device chips when stacked, and extend beyond the wafer surfaces to provide continuous protection. This merging of functions reduces the need for separate protective coating steps while achieving comprehensive foreign matter suppression.
Data Source
AI summary
A laminated device chip manufacturing method includes: a first wafer processing step of exposing a first resin layer disposed in first grooves to an undersurface side of a first wafer by thinning the first wafer fixed to a first support; a laminating step of laminating the undersurface side of the first wafer and a top surface side of a second wafer to each other such that the first resin layer exposed to the undersurface side of the first wafer and a second resin layer disposed in second grooves of the second wafer coincide with each other; a second wafer processing step of exposing the second resin layer disposed in the second grooves to an undersurface side of the second wafer by thinning the second wafer; and a resin layer cutting step of manufacturing laminated device chips by cutting the first resin layer and the second resin layer.