Laminated Waveguide Circuit Board for High Frequency Module Size Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High frequency circuit boards used in systems like radar and data communication systems face challenges in size reduction due to the configuration of waveguide lines and antenna boards, which increase the overall size when multiple openings are formed.
Innovation Solution
A circuit board design featuring a substrate with waveguide lines on one surface and laminated waveguides inside the substrate, which are electromagnetically coupled and have lead-out portions on multiple surfaces, reducing the board's size by allowing connection on multiple surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple openings of waveguides are formed on the circuit board, then the high frequency module can transmit multiple signals, but the size of the circuit board increases
Solution Approach 1:
The patent transitions from planar waveguide openings on the board surface to three-dimensional laminated waveguides embedded within the substrate. By utilizing the thickness dimension of the substrate, multiple waveguide layers can be stacked vertically, allowing multiple signal transmissions without increasing the board's planar area. The laminated structure enables signals to propagate through different layers and exit at different positions, achieving multi-signal capability while maintaining compact footprint.
Solution Approach 2:
The patent embeds multiple waveguide structures within the substrate layers, nesting them in a compact configuration. The waveguides are integrated into the substrate thickness, with inner and outer waveguides positioned at different depths and locations. This nested arrangement allows multiple waveguide functions to coexist within a single board volume, eliminating the need for separate board areas for each waveguide opening.
2Reliability
If waveguide lines and antenna boards are arranged on opposing surfaces, then signal transmission is enabled, but the overall module size increases
Solution Approach 1:
The patent combines the waveguide transmission function and antenna function into a single integrated board structure. Instead of using separate circuit board and antenna board assemblies, the invention integrates waveguide lines, laminated waveguides, and antenna elements within one substrate. This merging eliminates the need for opposing surface arrangements and reduces the overall module volume while maintaining reliable signal transmission through the integrated high frequency circuit paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the size of the circuit board and high frequency modules, enabling better alignment and heat dissipation while maintaining high frequency signal transmission efficiency.
Implementation Method 1
The laminated waveguide is electromagnetically coupled to the waveguide line, and has a lead-out portion led out from inside the substrate to a surface other than the first surface
Data Source
AI summary
A circuit board is provided. The circuit board includes a substrate, a waveguide line and a laminated waveguide. The waveguide line is at least partially positioned on a first surface of the substrate. The waveguide line transmits a high frequency signal. The laminated waveguide is formed inside the substrate. The laminated waveguide is electromagnetically coupled to the waveguide line, and has a lead-out portion led out from inside the substrate to a surface other than the first surface. The laminated waveguide includes a dielectric layer, a pair of main conductive layers and a through conductor group. The pair of main conductive layers sandwiches the dielectric layer in a thickness direction thereof. In the through conductor group, a plurality of through conductors are arranged along a high frequency signal transmitting direction. The plurality of through conductors electrically connect the pair of main conductive layers.