Laminating Apparatus with Dual Flat Press for Planarized Surfaces
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Solution Overview
Problem
Conventional laminating apparatuses fail to achieve high surface planarity for resin films on substrates with irregularities, leading to bulky buildup boards that do not meet the size reduction requirements of advanced electronic devices.
Innovation Solution
A laminating apparatus that includes a vacuum laminating device for conformal contact, a first flat press device with hydraulic cylinders and shock absorbers for initial planarization, and a second flat press device with servomotors for further planarization under different conditions, ensuring a highly planarized surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single flat press device is used to planarize the resin film, then the device complexity is low, but the surface planarity of the laminate is insufficient
Solution Approach 1:
The flat press device is divided into two separate devices: a first flat press device for initial planarization and a second flat press device for final planarization. Each device performs a specific stage of the planarization process, allowing the system to achieve high surface planarity through sequential processing while keeping each individual device relatively simple in structure.
Solution Approach 2:
The first flat press device performs preliminary planarization of the resin film before it enters the second flat press device. This preliminary action removes major irregularities and prepares the surface for final planarization, enabling the second device to focus on achieving the required surface planarity with finer control.
2Manufacturing precision
If shock absorbers are provided in both flat press devices, then the pressing stability is high, but the ability to achieve high surface planarity in the second pressing is reduced
Solution Approach 1:
The shock absorber configuration is made non-uniform across the two flat press devices. The first flat press device is equipped with shock absorbers to provide stability during initial planarization, while the second flat press device has no shock absorbers or fewer shock absorbers to allow for finer, more precise pressing control during final planarization. This local differentiation optimizes each device for its specific function.
Solution Approach 2:
The pressing system transitions from a stable, shock-absorbed configuration in the first device to a more dynamic, controllable configuration in the second device. By removing or reducing shock absorbers in the second flat press device, the system gains the flexibility and precision needed for final surface planarization while maintaining overall process stability through the sequential arrangement.
3Manufacturing precision
If the same pressing conditions are used in both flat press devices, then the process is simple, but the surface planarity cannot be sufficiently improved
Solution Approach 1:
The first flat press device applies pressing conditions optimized for initial planarization, removing major surface irregularities. The second flat press device then applies different pressing conditions optimized for final planarization, achieving the required surface planarity. This sequential application of different conditions allows each device to be tuned for its specific stage of the process.
Solution Approach 2:
The pressing conditions are changed between the two flat press devices, with each device operating under parameters optimized for its specific function. The first device uses conditions suitable for rough planarization, while the second device uses conditions optimized for fine planarization, allowing the system to achieve high surface planarity through parameter optimization at each stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus produces a laminate with a highly planarized surface, exceeding the planarity achieved by conventional methods, which is essential for the size reduction and performance enhancement of electronic devices.
Implementation Method 1
a vacuum laminating device which brings the film into close conformal contact with the substrate under reduced pressure
Implementation Method 2
at least one of the pair of first plates including a first heating platen
Implementation Method 3
at least one of the pair of second plates including a second heating platen
Data Source
AI summary
A laminating apparatus is provided, which is capable of producing a laminate having a highly planarized surface. The laminating apparatus is arranged to laminate a film on an irregular surface of a substrate having irregularities, and includes a vacuum laminating device which brings the film into close conformal contact with the substrate under reduced pressure to form a first temporary laminate, a first flat press device which presses the first temporary laminate to form a second temporary laminate having a substantially planarized irregular surface, and a second flat press device which presses the second temporary laminate under different conditions from the first flat press device to form a product laminate having a planar surface.