Laminating Board Metal Layer Shields OLED Light Emitting Structure
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Solution Overview
Problem
The fabrication of illumination devices using organic light emitting materials is complicated by the need for sealing to prevent external gas and water, which requires high temperatures that can deteriorate the materials and increase fabrication time and cost.
Innovation Solution
A simplified method involving a laminating board with a metal layer and pads, where the metal layer shields the light emitting layer and serves as a barrier, allowing for attachment to a substrate using a sealant at lower temperatures, thereby simplifying the fabrication process and preventing gas and water penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sealing is performed using conventional methods with high temperature bonding, then the light emitting structure is effectively sealed against external gas and water, but the organic light emitting material deteriorates and fabrication cost increases
Solution Approach 1:
The patent changes the temperature parameter from conventional high temperature (120-170°C) bonding to low temperature lamination, and changes the sealing mechanism from chemical bonding to physical barrier using the laminating board with metal layer, thereby protecting the organic light emitting material from thermal deterioration while achieving effective sealing
Solution Approach 2:
The patent uses a composite laminating board structure comprising a carrier body with a metal layer (such as aluminum foil) and adhesive layers, combining the barrier properties of metal with the bonding properties of adhesive to achieve sealing without high temperature that would damage organic materials
2Reliability
If conventional sealing processes are used, then the light emitting structure is protected from external gas and water, but fabrication time and cost increase
Solution Approach 1:
The patent merges the sealing function and the protective barrier function into a single laminating board application step, eliminating separate sealing processes and high temperature bonding steps, thereby reducing fabrication time while maintaining effective sealing against gas and water
Solution Approach 2:
The laminating board is prepared in advance with the metal layer and adhesive layers already configured, allowing direct application to the light emitting structure without requiring on-site preparation of sealing materials or equipment, thus reducing fabrication time
3Reliability
If the light emitting structure is completely sealed, then protection from external gas and water is achieved, but the fabrication process becomes complicated
Solution Approach 1:
The laminating board serves multiple functions simultaneously: it acts as a sealing barrier against gas and water, provides a protective cover for the light emitting structure, and includes conductive elements for electrical connection, thereby simplifying the overall fabrication process by consolidating multiple steps into one
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of damaging the organic light emitting material during fabrication, lowers the required temperature for assembly, and simplifies the process, reducing costs and improving yield while ensuring effective sealing and electrical connectivity.
Implementation Method 1
The sealant is disposed on the substrate and covers the light emitting structure... the sealant covers the light emitting structure, and the metal layer of the laminating board shields an area of the light emitting layer
Implementation Method 2
The metal layer is exposed at a first surface of the carrier body, is in contact with the sealant and shields an area of the light emitting layer of the light emitting structure
Implementation Method 3
attaching a laminating board to a substrate by a sealant while the sealant is located between the substrate and the laminating board
Data Source
AI summary
An illumination device includes a substrate, a light emitting structure, a sealant, and a laminating board is provided. The light emitting structure includes a first electrode layer, a light emitting layer and a second electrode layer stacked on the substrate sequentially. The sealant covers the light emitting structure. The laminating board is attached to the substrate. The sealant is located between the laminating board and the substrate. The laminating board includes a carrier body, a metal layer and a plurality of pads. The metal layer is exposed at a first surface of the carrier body, is in contact with the sealant and shields an area of the light emitting layer of the light emitting structure. The pads are exposed at the first surface of the carrier body and electrically connected to the first electrode layer and the second electrode layer. The metal layer is electrically isolated from the pads.