Laminating Cooling Device Preheating for Composite Surface Quality
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Solution Overview
Problem
Existing laminating methods for composite bodies suffer from surface quality issues due to rapid heating and cooling, leading to potential quenching, bubbling, or warping, which complicates the production process and increases costs.
Innovation Solution
A method where the cooling device is preheated to a starting temperature between 30°C and 90°C, allowing controlled cooling of the composite body after lamination, preventing surface quenching and ensuring high product quality by maintaining a temperature gradient through a temperature control chamber with a medium flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If rapid cooling is applied after lamination to reduce cycle time, then productivity increases, but surface quality deteriorates due to quenching, bubbling, or warping
Solution Approach 1:
The cooling device is preheated to a starting temperature (e.g., 50°C to 80°C) before contact with the laminated stack. This preliminary heating action prevents thermal shock and surface defects during subsequent cooling, allowing rapid cooling to be performed without compromising surface quality.
Solution Approach 2:
The cooling device temperature is dynamically controlled in two stages: first maintained at a starting temperature to prevent quenching, then reduced to a lower cooling temperature for efficient cooling. This dynamic temperature adjustment enables both high productivity and surface quality.
2Temperature
If the cooling device is directly cooled to room temperature after lamination, then cooling efficiency increases, but surface defects occur due to thermal shock
Solution Approach 1:
The cooling device is preheated to a starting temperature before contacting the hot laminated stack. This preliminary action creates a controlled temperature gradient that prevents thermal shock and associated surface defects while maintaining efficient cooling performance.
Solution Approach 2:
The temperature parameter of the cooling device is changed in a controlled manner: first heated to a starting temperature (e.g., 50-80°C), then gradually reduced to a lower cooling temperature. This parameter change strategy prevents harmful thermal shock while maintaining cooling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the flexibility and safety of the manufacturing process, preventing surface defects like bubbling or warping, and ensures high-quality composite bodies by controlling the cooling process effectively.
Implementation Method 1
the at least one cooling device of the laminating device is heated to a starting temperature before being moved into a cooling position
Implementation Method 2
maintaining a temperature gradient through a temperature control chamber with a medium flow
Implementation Method 3
the at least one cooling device, heated to the starting temperature, is moved in the cooling position to contact the hold-down device of the stack and/or the laminating sheet
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
The invention relates to a method for laminating a stack (14) consisting of several substrate layers (12) to form a composite body (15), wherein the stack (14) of several substrate layers (12) is positioned in a laminating position in a laminating device (11), wherein the stack (14) is fixed in the laminating position by means of a hold-down device (24) and/or laminating sheet (28, 36), wherein at least one heating device (31) is moved into a working position (35) relative to the stack (14) and the stack (14) is heated to a laminating temperature with the at least one heating device (31) and the substrate layers (12) are laminated to form the composite body (15), wherein subsequently the at least one heating device (31) is moved out of the working position (35) and at least one cooling device (32) is moved into a cooling position (34) for cooling the composite body (15).wherein the at least one cooling device (32) is heated to a starting temperature for cooling the composite body (15) which is lower than the lamination temperature of the substrate layers (12) of the stack (14) and higher than a cooling temperature of the cooling device (32) at the end of the cooling cycle, wherein the at least one cooling device (32) heated to the starting temperature is moved into the cooling position (34) for contact with the hold-down device (24) and/or laminating sheet (28, 36), and wherein after the at least one cooling device (32) has entered the cooling position (34), a reduction of the starting temperature to the cooling temperature of the cooling device (32) is controlled.