Laminating Electronic Data Carriers with Asymmetrical Heating
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Solution Overview
Problem
During the lamination of multiple layers to form a data carrier, such as a security document or card, high temperature gradients can cause the outer layers to heat up quickly, leading to premature softening and potential damage to pressure-sensitive electronic components due to asymmetrical temperature profiles and pressure-induced flow processes.
Innovation Solution
The method involves controlling the heating temperature of upper and lower laminating plates to create a specific heating characteristic with a minimum temperature in the carrier layer or intermediate layer, ensuring the protective layers soften before the carrier layer, thereby preventing flow into the recess and potential electronic failures. This is achieved by using different heating temperatures or thermal conductivity of press pads to create an asymmetrical temperature profile, allowing the protective layers to fill gaps before the carrier layer softens.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If symmetrical heating is applied to the stack during lamination, then the outer layers heat up quickly and reach softening temperature, but the carrier layer and intermediate layer also reach softening temperature causing flow processes that damage electronic components
Solution Approach 1:
The patent applies asymmetrical heating by configuring the heating plates to generate a temperature profile with a minimum in the carrier layer and/or intermediate layer region. This asymmetrical temperature distribution ensures outer layers soften and flow to fill recesses before the carrier layer reaches softening temperature, preventing damage to electronic components while maintaining lamination effectiveness.
Solution Approach 2:
The patent creates different thermal conditions in different regions of the stack. The heating characteristic is specifically designed to have a minimum temperature in the carrier layer and/or intermediate layer region, allowing localized control of softening behavior. This enables the outer layers to soften and flow into recesses while the carrier layer remains below its softening temperature and protects electronic components.
2Strength
If high pressure is applied during lamination to join layers, then the layers are compacted effectively, but the carrier layer deforms plastically and electronic components are damaged
Solution Approach 1:
The patent employs preliminary action by first allowing the outer layers to soften and flow into recesses to fill gaps and protect electronic components, before the carrier layer reaches its softening temperature. This sequence of softening and filling occurs prior to the carrier layer becoming vulnerable to deformation under pressure, thereby preserving component position accuracy while achieving effective lamination.
3Ease of manufacture
If the carrier layer is positioned centrally in the stack, then the structure is symmetrical and easy to manufacture, but the electronic components are exposed to flow processes from all sides increasing damage risk
Solution Approach 1:
The patent resolves this contradiction by introducing asymmetry in the temperature profile rather than in the physical stacking sequence. The heating characteristic generates a minimum temperature in the carrier layer and/or intermediate layer region, creating an asymmetrical thermal environment that protects centrally positioned electronic components from flow processes while maintaining the ease of symmetrical stack assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents plastic deformation and electronic failures by ensuring the carrier layer and intermediate layer remain unaffected by flow processes, maintaining the position of electronic components and preventing damage during lamination.
Implementation Method 1
the upper and lower laminating plate are each subjected to a laminating temperature, so that a heating temperature occurring in the stack to be laminated between the upper and lower laminating plate is controlled with a heating characteristic
Implementation Method 2
the cover layer or protective layer covering the at least one recess in the intermediate layer has already reached a softening temperature before the carrier film and/or the intermediate layer has reached the softening temperature, so that flow processes of this at least one cover layer and/or protective layer into the recess in the intermediate layer are already initiated
Data Source
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AI summary
The invention relates to a method for laminating several layers (35, 37, 39, 40, 41) arranged in a stack (34) to form a data carrier (21), which is formed by at least one carrier layer (35) with at least one electronic component (32) arranged thereon, as well as with an intermediate layer (37) having a receptacle in which the at least one electronic component (32) is positioned, and with at least one layer (39, 40, 41) covering the electronic component (32), with a laminating device (45) which has an upper tool (46) and a lower tool (47) each with a laminating plate (48, 49), in which the stack (34) to be laminated is positioned between the upper and lower laminating plates (48, 49) and in which the upper and lower laminating plates (48, 49) are moved towards the stack (34) and the stack (34) is at least is subjected to pressure and a lamination process with a heating phase for laminating the layers (35,37, 39, 40, 41) to the data carrier (21), wherein during the pressure application of the stack (34) the upper and the lower laminating plates (48, 49) are each heated to a temperature (T1, T2), so that a heating characteristic (55) that develops in the stack (34) to be laminated between the upper and lower laminating plates (48, 49) is controlled such that its temperature minimum lies in the carrier layer (35) and/or intermediate layer (37).