Laminating Apparatus Shape Pad Incision Patterns
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Solution Overview
Problem
The challenge lies in effectively bonding a flexible display device's window and panel while protecting the driver circuit from damage due to pressure, especially as display devices shrink and the distance between the display area and driver circuit decreases, increasing the risk of damage during the lamination process.
Innovation Solution
A laminating apparatus featuring a shape pad with incision patterns that apply varying pressures to the panel, ensuring the driver circuit area receives low or no pressure, while the surrounding areas receive higher pressure for bonding, using a combination of a first jig fixing the window and a second jig with a shape pad that includes a top surface, sides, and inwardly recessed incision patterns to manage pressure distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If uniform pressure is applied during lamination to ensure bonding between window and panel, then bonding quality is improved, but the driver circuit may be damaged due to excessive pressure
Solution Approach 1:
The shape pad incorporates incision patterns that create local variations in pressure distribution. The incisions reduce the pad's contact area over the driver circuit region, automatically providing lower pressure to that specific area while maintaining higher pressure in other areas for effective bonding. This local differentiation resolves the contradiction between needing uniform bonding pressure and avoiding damage to sensitive components.
2Volume of moving object
If the distance between display area and driver circuit is reduced to shrink device size, then device compactness is improved, but the risk of driver circuit damage during lamination increases
Solution Approach 1:
The incision patterns in the shape pad create localized low-pressure zones that correspond to the driver circuit position. Even as the overall device size shrinks and the driver circuit moves closer to the display area, the patterned pressure distribution ensures that the sensitive circuit region always receives reduced pressure, while other areas maintain sufficient pressure for bonding.
3Strength
If pressure is applied to bond window and panel, then bonding strength is improved, but uniformity of pressure distribution becomes difficult to maintain due to device geometry
Solution Approach 1:
The shape pad's incision patterns modify the physical parameters of the contact interface by creating varying contact areas across different regions. This geometric modification changes the pressure distribution parameter from uniform to non-uniform, with automatically reduced pressure over the driver circuit area, thereby achieving both sufficient bonding strength and protected circuit areas.
Data Source
AI summary
A method of laminating includes a step of preparing each of a first jig to fix a window, and a second jig including a shape pad, in which the second jig faces the first jig, and the shape pad includes each of a top surface protruding toward the first jig, sides surrounding the top surface, and at least one incision pattern, which is inwardly recessed from at least one of the sides of the shape pad and extends toward the first jig. The method further includes a step of bonding the window and the panel by applying pressure to the panel with the shape pad.