Lamination EMI Shield Case for Compact Electronic Devices
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Solution Overview
Problem
Electronic devices face challenges in effectively blocking electromagnetic interference (EMI) due to their compact design and high-density mounting, which can lead to electromagnetic noise, and existing shield cases with inner wells are difficult to manufacture and inspect for proper detachment.
Innovation Solution
A shield case with a lamination structure is designed to surround and cover specific regions of a substrate, using a combination of first and second electromagnetic interference shields, along with a method for stable placement and testing to ensure effective EMI blocking without detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield case with inner well structure is used, then electromagnetic interference blocking capability is improved, but manufacturing complexity and inspection difficulty increase
Solution Approach 1:
The shield case is divided into multiple separate shield members (first shield member and second shield member) that can be independently manufactured and then assembled. This segmentation simplifies manufacturing by allowing standard fabrication processes for each component while maintaining the overall shielding effectiveness through proper assembly and grounding connections.
Solution Approach 2:
The shield case employs a nested structure where the second shield member is positioned within or adjacent to the first shield member, forming a layered configuration. This nesting approach maintains effective EMI blocking while reducing material usage and simplifying the overall structure compared to a monolithic inner-well design.
2Adaptability or versatility
If high-density mounting is implemented, then device compactness and multifunctionality are improved, but electromagnetic interference between components increases
Solution Approach 1:
The shield case applies local shielding by positioning shield members specifically around high-interference-risk areas where high-density mounting occurs. The grounding connections are strategically placed at critical locations to provide localized EMI protection without requiring complete enclosure of the entire device, thus maintaining compactness while addressing specific interference problems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The lamination structure effectively blocks electromagnetic interference between components of electronic devices, simplifying fabrication and repair processes while ensuring reliable EMI shielding without detachment issues.
Implementation Method 1
a shield case having a lamination structure capable of blocking electromagnetic waves between components
Data Source
AI summary
An electronic device including a substrate on which an electronic component is mounted according to various embodiments may include: a first electromagnetic interference (EMI) shield configured to shield the electronic component included in a first region of the substrate; and a second EMI shield supported by at least a part of the first EMI shield and configured to shield the electronic component included in a second region of the substrate.