Lamination Molding Cutting Allowance Optimization

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Solution Overview

Problem

The size of the cutting allowance in lamination molding apparatuses varies due to temperature changes and environmental factors, making it difficult to determine the optimal size, often resulting in it being set too large, which prolongs the cutting and molding times.

Innovation Solution

A lamination molding apparatus that calculates the displacement between the target and actual laser beam irradiation positions and determines a recommended cutting allowance size based on this displacement, generating a new project file to optimize the cutting allowance size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the cutting allowance is set larger to account for laser beam position deviation, then the manufacturing precision is improved, but the productivity deteriorates due to increased cutting time

Engineering Contradiction:
Improvepositioning accuracyVSAvoidmolding cycle time
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The system measures the actual laser beam irradiation position and feeds back the displacement information to automatically adjust the cutting allowance size. This closed-loop feedback mechanism enables dynamic optimization of the cutting allowance based on actual positioning performance, resolving the contradiction between ensuring sufficient cutting allowance for accuracy and minimizing cutting allowance for productivity.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The cutting allowance size is changed from a fixed predetermined value to a dynamically adjusted parameter based on measured laser beam displacement. By changing the parameter (cutting allowance size) according to actual positioning conditions, the system achieves both high precision and high efficiency.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the cutting allowance is set larger to ensure adequate material removal, then the reliability is improved, but the loss of time increases due to prolonged cutting and molding operations

Engineering Contradiction:
Improvecutting allowance adequacyVSAvoidcutting time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The system uses feedback from actual laser beam position measurements to determine the appropriate cutting allowance size. This ensures that the cutting allowance is always adequate (reliable) while minimizing excess material removal that would waste time, replacing the conservative fixed-large-allowance approach with a precise adaptive approach.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

Instead of consistently applying excessive cutting allowance to ensure reliability, the system applies only the necessary amount of cutting allowance based on actual laser beam displacement measurements, eliminating the time waste associated with excessive material removal while maintaining adequate cutting coverage.

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for a more accurate determination of the cutting allowance size, reducing the time required for molding by shortening the cutting time and improving the efficiency of the lamination molding process.

Implementation Method 1

a laser beam emitter configured to irradiate material powder with a laser beam for sintering the material powder

Methodology Applied
Scientific EffectLaser beam irradiation: Laser

Implementation Method 2

irradiation of a predetermined position of the material powder layer with a laser beam, thereby sintering the material powder

Methodology Applied
Scientific EffectSintering: Sintering

Data Source

PatentUS10376959B2Lamination molding apparatus
Publication Date: 2019.08.13 SODICK CO LTD
  • US10376959B2 patent drawing
  • US10376959B2 patent drawing
  • US10376959B2 patent drawing

AI summary

According to the present invention, a lamination molding apparatus configured to mold a desired lamination molded object based on a project file, comprising: a chamber covering a molding region and being filled with an inert gas; a laser beam emitter configured to irradiate material powder with a laser beam for sintering the material powder, in an irradiation region on a material powder layer formed on a molding region, a cutting machine configured to move a cutting tool, within the chamber, for cutting a predetermined cutting allowance from a sintered layer obtained by sintering the material powder a calculation means configured to calculate an amount of displacement between a target irradiation position and an actual irradiation position of the laser beam, and to determine a recommended value of a size of the cutting allowance based on a time transition of the amount of displacement or to generate a new project file containing a size of the cutting allowance set based on a time transition of the amount of displacement, is provided.