Lamination Stack Adhesive Application With Rotating Lamination Surfaces
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Solution Overview
Problem
Existing methods for applying adhesive to laminations in stacks require elaborate application heads with multiple piezo valves, leading to high costs and unreliable adhesion due to inconsistent chemical and physical properties of insulation varnishes, resulting in insufficient bonding between laminations.
Innovation Solution
The method involves rotating the lamination about its axis or moving the application head relative to the lamination to apply adhesive evenly over the entire surface, using a simplified application head design with fewer nozzles, and incorporating cleaning and activating stations downstream of the punching tool to ensure reliable adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If adhesive is applied onto laminations by means of multiple piezo valves in an elaborate application head, then adhesive can be applied to multiple points, but the application head becomes expensive and complex
Solution Approach 1:
The application head is divided into multiple independent application nozzles that can be selectively activated. Instead of using a complex multi-valve system, the patent employs a simplified structure where individual nozzles are positioned to apply adhesive at specific locations on the lamination surface, reducing overall system complexity while maintaining precise adhesive placement
Solution Approach 2:
The laminations undergo preliminary cleaning and activation treatments before adhesive application. This preparatory action ensures that the adhesive bonds effectively to the lamination surface without requiring complex adhesive delivery systems, as the surface is pre-conditioned for optimal adhesion
2Object-affected harmful factors
If insulation varnishes are used on laminations, then electrical insulation is provided, but the bonding reliability becomes unpredictable due to inconsistent chemical and physical properties
Solution Approach 1:
A cleaning step is performed before adhesive application to remove contaminants from the lamination surface, including inconsistent residues from insulation varnishes. This preliminary cleaning action ensures a consistent, clean bonding surface that eliminates the variability caused by varnish contamination, thereby improving bonding reliability while maintaining electrical insulation properties
Solution Approach 2:
The adhesive is applied selectively to specific regions of the lamination where bonding is required, rather than covering the entire surface. This localized application approach ensures that adhesive contacts only the intended bonding areas, avoiding interference from insulation varnish on non-bonding surfaces and achieving reliable bonds at critical locations
3Device complexity
If adhesive is applied only in punctiform fashion, then application head design is simplified, but sufficient adhesion cannot be established within required time
Solution Approach 1:
The adhesive application system uses multiple discrete nozzles arranged to cover different regions of the lamination. Each nozzle applies adhesive to a specific point or small area, and the combined effect of multiple nozzles creates sufficient total adhesive coverage for reliable bonding, while each individual nozzle remains simple in design
Solution Approach 2:
The system applies adhesive to more locations than the absolute minimum required for bonding. By using multiple nozzles to apply adhesive at numerous points across the lamination surface, the system ensures that sufficient adhesive is delivered to all critical bonding areas within the required time, even though each individual application point uses a simple nozzle design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reproducible, solid bonding between laminations with a large adhesive surface area, reducing the complexity and cost of the application head while ensuring effective adhesion, even on thin laminations with varying qualities and coatings.
Implementation Method 1
the lamination is rotated about its axis in the application area of the application head and/or the application head is moved about the axis of the lamination in order to apply the adhesive
Implementation Method 2
at least one station for cleaning and/or for activating and/or for applying an adhesive onto the laminations is arranged downstream of the punching tool
Implementation Method 3
at least one station for cleaning and/or for activating and/or for applying an adhesive onto the laminations
Implementation Method 4
at least one adhesive is applied onto the laminations... a reproducible solid bond between the laminations within a stack can be easily achieved
Data Source
AI summary
In a method for producing stacks of laminations, in which at least one adhesive is applied onto annular laminations with at least one application head and laminations are stacked into a stack of laminations, the lamination is rotated about its axis in the application area of the application head and/or the application head is moved about the axis of the lamination in order to apply the adhesive onto the lamination. A system for carrying out the method features at least one punching tool, with which laminations are punched out of a sheet metal material, wherein at least one station for cleaning and/or for activating and/or for applying an adhesive onto the laminations is arranged downstream of the punching tool.