Lamination System Parallel Bonding Chambers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current lamination systems for display apparatuses face challenges in reducing bonding process time and improving spatial integration, which hinders the efficiency and throughput of panel assembly production, especially as display technologies demand larger, thinner, and more functional devices with limited spatial resources.
Innovation Solution
A lamination system incorporating a transfer shuttle, bonding chambers, and multiple robots to facilitate efficient movement and bonding of panels, with a controller managing the process to optimize the bonding cycles and spatial utilization, allowing for parallel and sequential operations across multiple bonding chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a serial process is used for bonding operations, then the process is simple to control, but the bonding time increases and productivity decreases
Solution Approach 1:
The bonding system is divided into multiple independent bonding chambers that can operate simultaneously. Each chamber can process panels in parallel, transforming a serial process into a parallel process. This segmentation increases productivity while maintaining manageable complexity through modular design.
Solution Approach 2:
Panels are pre-positioned on transfer shuttles before entering the bonding chambers. The transfer shuttles move panels between chambers and to the bonding area in advance, preparing the system for continuous operation. This preliminary positioning enables overlapping of operations and reduces idle time.
2Productivity
If multiple bonding chambers are added to increase productivity, then panel throughput improves, but the spatial requirement increases
Solution Approach 1:
Transfer shuttles are positioned within the movement range of robots, and bonding chambers are arranged in a compact configuration where transfer shuttles can access multiple chambers. The system nests transfer mechanisms within the bonding chamber footprint, allowing multiple chambers to occupy overlapping or adjacent spatial zones efficiently.
Solution Approach 2:
The system transitions from a linear serial arrangement to a multi-dimensional layout where bonding chambers are distributed in space while transfer shuttles operate on multiple levels or tracks. This spatial reconfiguration allows parallel processing without proportionally increasing the overall facility footprint.
3Loss of time
If transfer shuttles and robots are added to enable parallel bonding, then bonding time is reduced, but device complexity increases
Solution Approach 1:
Transfer shuttles serve multiple functions: they transport panels between bonding chambers, position panels for bonding, and coordinate with robot movements. The robots perform both transfer operations and bonding operations. This multi-functionality reduces the need for separate dedicated components, managing complexity while enabling parallel processing.
Solution Approach 2:
Transfer shuttles act as intermediary carriers between bonding chambers and the bonding area. They buffer the panel flow, allowing bonding chambers to operate independently and in parallel without direct coordination complexity. The shuttles mediate the coordination between multiple chambers and external processes.
Data Source
AI summary
Disclosed is a lamination system. A lamination system, which bonds a panel and a bonding target panel to from a panel assembly, according to one embodiment of the present invention may include a transfer which moves along a transfer shuttle and supports any one among the panel, the bonding target panel, and the panel assembly, a bonding chamber which is provided parallel to the transfer shuttle and bonds the panel and the bonding target panel, and a first robot which transfers any one among the panel, the bonding target panel, and the panel assembly between the transfer and the bonding chamber.