Lamination Transfer Films for Embedded Nanostructures

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Solution Overview

Problem

The challenge lies in fabricating nanostructures and microstructures on large glass substrates in a cost-effective manner while ensuring durability and protecting them from handling and environmental exposure, particularly for applications in display, lighting, and photovoltaic devices.

Innovation Solution

A transfer film with a sacrificial template layer and a thermally stable backfill layer is used, where the sacrificial template layer comprises inorganic nanomaterials and sacrificial material, allowing for the clean removal of the sacrificial material to leave a densified layer of inorganic nanomaterials on the backfill layer, which can then be transferred onto glass substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If nanostructures are fabricated directly on large glass substrates, then the structures can be used for light extraction and distribution in display devices, but the fabrication process becomes difficult and cost-ineffective

Engineering Contradiction:
Improvefabrication cost and difficultyVSAvoidnanostructure formation quality
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The fabrication process is divided into separate stages: first creating nanostructures on a flexible carrier film in a controlled environment, then transferring the entire structured film to the large glass substrate. This segmentation allows precise nanostructure formation on small-scale flexible substrates using techniques like lithography and etching, avoiding the difficulty of direct large-substrate fabrication while maintaining high manufacturing precision

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A flexible carrier film serves as an intermediary substrate that enables precise nanostructure fabrication. The film acts as a temporary platform where nanostructures can be formed with high precision using standard semiconductor fabrication techniques, then transferred to the final glass substrate, thus mediating between the limitations of direct glass fabrication and the requirements for high-quality nanostructures

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If nanostructures are exposed during handling and environmental exposure, then they can be accessed for functionality, but their durability and protection from damage is reduced

Engineering Contradiction:
Improvenanostructure accessibilityVSAvoiddurability and protection
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The nanostructures are nested within a multi-layer film structure that includes protective layers. The nanostructures are formed within the flexible carrier film and can be encapsulated by additional protective layers during the lamination process, allowing them to remain protected during handling while still providing their optical functionality when the film is applied to the display substrate

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The flexible carrier film itself acts as a protective shell that encases and protects the nanostructures during fabrication, handling, and transfer processes. This thin film structure provides mechanical protection while maintaining the nanostructures' optical properties, and can be designed with appropriate thickness and material properties to protect sensitive nanostructures from damage

Inventive Principle:
Principle #30Flexible shells and thin films

3Ease of manufacture

If transfer films are used to form nanostructures on glass substrates, then cost-effective fabrication is achieved, but the complexity of the transfer process increases

Engineering Contradiction:
Improvefabrication costVSAvoidtransfer process complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

Multiple functions are merged into the flexible carrier film structure: it serves as the substrate for nanostructure fabrication, provides mechanical support during handling, enables transfer to the glass substrate through lamination, and can provide protective encapsulation. This merging reduces the need for separate complex process steps and equipment, simplifying the overall transfer process while maintaining cost-effectiveness

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The flexible carrier film is designed as a universal platform that can accommodate various nanostructure patterns and types, work with different glass substrate sizes and shapes, and interface with standard display manufacturing equipment. This multi-functionality reduces the need for specialized equipment and process variations, thereby reducing process complexity despite the added transfer step

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the cost-effective fabrication and transfer of nanostructures onto large glass substrates, enhancing light extraction, light distribution, and durability in display and photovoltaic devices, while maintaining the structural integrity and optical properties.

Implementation Method 1

The sacrificial material of the sacrificial template layer is capable of being cleanly baked out while leaving a densified layer of inorganic nanomaterials

Methodology Applied
Scientific EffectPyrolysis: Pyrolysis

Implementation Method 2

The sacrificial material of the sacrificial template layer is capable of being cleanly baked out while leaving a densified layer of inorganic nanomaterials

Methodology Applied
Scientific EffectCombustion: Combustion

Implementation Method 3

leaving a densified layer of inorganic nanomaterials on the structured surface of the thermally stable backfill layer

Methodology Applied
Scientific EffectSintering: Sintering

Data Source

PatentEP3332964B1Lamination transfer films for forming embedded nanostructures
Publication Date: 2022.10.05 3M INNOVATIVE PROPERTIES CO
  • EP3332964B1 patent drawingFigure 1A~1C
  • EP3332964B1 patent drawingFigure 2~4
  • EP3332964B1 patent drawingFigure 5~6

AI summary

The present invention relates to a method of using a transfer film comprising: providing a receptor substrate; laminating a transfer film to the receptor substrate, wherein the transfer film comprises at least one of a sacrificial support layer or a sacrificial template layer, wherein at least one of the sacrificial support layer or the sacrificial template layer have a structured surface, and wherein at least one of the sacrificial support layer or the sacrificial template layer comprise inorganic nanomaterials and sacrificial material; and densifying the at least one of the sacrificial support layer or the sacrificial template layer.