Laminator Tension Feedback for Precise Coverlay Alignment

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Solution Overview

Problem

Existing laminating methods face challenges in achieving precise alignment and efficient bonding of substrates and coverlays in Roll-to-Roll (R2R) processing for Flexible Printed Circuit Boards (FPCBs), particularly when precise alignment is required, leading to reduced productivity and precision.

Innovation Solution

A laminator system with substrate and film tension adjustment parts, heating rollers, and image photographing units to control tension and alignment, ensuring precise bonding through a Roll-to-Roll process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the heating roll method is used for bonding substrate and coverlay film, then productivity is improved due to continuous processing, but manufacturing precision deteriorates because precise alignment is difficult to maintain in Roll-to-Roll processing

Engineering Contradiction:
Improvebonding process timeVSAvoidalignment precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-aligning the substrate and coverlay film using alignment marks and sensors before they enter the heating roll bonding zone. This ensures that the precise alignment is established in advance, allowing continuous high-speed processing without sacrificing alignment accuracy during the bonding process.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements feedback control by using optical sensors to continuously monitor the alignment between substrate and coverlay film during Roll-to-Roll processing. The system provides real-time feedback to adjust the position of the coverlay film, maintaining precise alignment throughout the continuous bonding process and resolving the contradiction between productivity and precision.

Inventive Principle:
Principle #23Feedback

2Manufacturing precision

If the hot press method is used for bonding substrate and coverlay film, then manufacturing precision is improved through careful alignment, but productivity deteriorates due to longer processing time and complicated apparatus

Engineering Contradiction:
Improvealignment precisionVSAvoidbonding process time
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent applies segmentation by dividing the bonding process into distinct functional zones: an alignment zone with sensors and adjustment mechanisms, and a bonding zone with heating rolls. This segmentation allows precise alignment to be achieved in the first zone, followed by rapid continuous bonding in the second zone, combining the advantages of both methods while eliminating their disadvantages.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent replaces the complex mechanical alignment system of traditional hot press methods with an optical sensing and control system. This substitution enables precise alignment through non-contact optical measurement and automated control, significantly reducing processing time and apparatus complexity while maintaining high alignment precision during continuous Roll-to-Roll processing.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves productivity and precision in the bonding process by maintaining tension and alignment, reducing defects, and enhancing the efficiency of FPCB manufacturing.

Implementation Method 1

a heating roller part for bonding the substrate and the film so that the plurality of coverlays respectively covers the metal pattern

Methodology Applied
Scientific EffectLamination: Lamination

Implementation Method 2

a heating roller part for bonding the substrate and the film

Methodology Applied
Scientific EffectHeat: Heating

Data Source

PatentEP4068916B1laminator
Publication Date: 2025.07.02 DOOSAN CORP
  • EP4068916B1 patent drawingFigure 1
  • EP4068916B1 patent drawingFigure 2
  • EP4068916B1 patent drawingFigure 3

AI summary

A laminator according to an exemplary embodiment of the present invention includes: a substrate supply part for supplying a substrate on which a metal pattern is formed; a coverlay supply part for supplying a film to which a plurality of coverlays is attached; a heating roller part for bonding the substrate and the film so that the plurality of coverlays respectively covers the metal pattern; a substrate tension adjustment part and a film tension adjustment part for adjusting tension of the substrate and the film transferred to the heating roller part; a bonding state image photographing part for measuring an interval between the plurality of coverlays after the heating roller part bonds the substrate and the film; and an adjustment part for adjusting the substrate tension adjustment part or the film tension adjustment part so that the interval between the plurality of coverlays measured by the bonding state image photographing part maintains a preset allowable interval.