Lamp Base Heat Dissipation via Surface Treatment
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Solution Overview
Problem
Conventional semiconductor processing lamps experience reduced lifespan due to excessive heating, leading to seal rupture and oxidation of molybdenum foils, which causes heat to be absorbed at the lamp base, necessitating improved heat dissipation methods.
Innovation Solution
A lamp assembly with a quartz bulb and a sleeve surrounding the lamp base, featuring a surface treatment to scatter light away from the base, such as coatings or sintered powder materials, and a potting compound for enhanced heat transfer, with a sleeve cross-sectional area less than 0.95 times that of the bulb to facilitate efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional lamp cooling mechanisms are used (water-cooled stainless steel tubes, porous potting compounds, reflector sleeves), then heat dissipation from the lamp base is improved, but device complexity increases
Solution Approach 1:
The patent extracts the cooling function from the complex multi-component conventional system (water-cooled tubes, porous compounds, reflector sleeves) and integrates it directly into the bulb structure through surface treatment. The bulb itself becomes the heat dissipation element via its outer surface treatment, eliminating the need for elaborate external cooling mechanisms while maintaining effective heat dissipation from the lamp base.
Solution Approach 2:
The patent merges the cooling function with the bulb structure by applying surface treatment to the bulb's outer surface. This combines the radiative heating function and the heat dissipation function into a single integrated component, eliminating the need for separate cooling mechanisms and reducing overall device complexity.
2Temperature
If elaborate cooling structures are implemented (multiple stainless steel tubes, water cooling systems), then lamp base temperature control is improved, but manufacturing complexity increases
Solution Approach 1:
The patent removes the need for complex multi-tube cooling structures and water cooling systems by extracting the heat dissipation function and implementing it through surface treatment of the bulb. This simplifies manufacturing by eliminating precision-toleranced tube assemblies, sealing requirements, and water cooling infrastructure.
Solution Approach 2:
The patent changes the approach from active cooling (water circulation through tubes) to passive radiative cooling through surface treatment. This parameter change from active to passive thermal management simplifies manufacturing by eliminating the need for complex cooling system assembly while maintaining effective temperature control.
3Temperature
If heat shields or internal reflector plates are added to the bulb, then heat dissipation from the filament area is improved, but device complexity increases
Solution Approach 1:
The patent removes internal heat shields and reflector plates from the bulb assembly and replaces them with surface treatment on the bulb's outer surface. This extracts the heat management function from internal components and implements it through the bulb's exterior, reducing the number of parts and simplifying the overall assembly.
Solution Approach 2:
The patent applies surface treatment to the bulb's outer surface, which may involve changing the optical properties (reflectivity, emissivity) of the surface. This color/optical property change enables the bulb surface to effectively manage heat radiation without requiring additional internal heat shields or reflector plates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution extends lamp life by preventing radiation from reaching the lamp base, reducing the risk of premature failure and maintaining the base at a lower temperature, thereby enhancing operational reliability.
Implementation Method 1
at least a portion of the bulb has a surface treatment adapted to reflect or scatter light away from the lamp base
Implementation Method 2
at least a portion of the bulb has a surface treatment adapted to reflect or scatter light away from the lamp base
Implementation Method 3
a potting compound inside the sleeve
Implementation Method 4
a radiation generating filament
Implementation Method 5
infrared radiation from the lamps radiates through an upper window, light passageways and a lower window onto a rotating semiconductor substrate
Data Source
Figure 1~2
Figure 3~4
AI summary
A lamp assembly for the lamp assembly adapted for use in a substrate thermal processing chamber to heat the substrate to temperatures up to at least about 1100° C is disclosed. In one embodiment, the lamp assembly comprises a bulb enclosing at least one radiation generating filament attached to a pair of leads, the bulb having an inner surface and an outer surface, a lamp base configured to receive the pair of leads and at least a portion of the bulb having a surface treatment adapted to reflect light away from the lamp base. In another embodiment, a sleeve covers the lamp base, which has a cross-sectional area less than about 1.2 times the cross-sectional area of the bulb.