Lamp Cover Heat Conducting Tab Thermal Management
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Solution Overview
Problem
LED lamps face heat dissipation challenges due to increasing heat generation from high-efficiency LEDs, while control circuit and electronic elements also produce heat that can accumulate and affect the LED's service life without adequate dissipation methods.
Innovation Solution
A lamp with a heat conducting structure and cover made of thermally conductive material, featuring a hollow configuration with an interlayer dividing it into two spaces, where the LED assembly is in one space and the power plug with control circuit board is in the other, with heat conducting tabs facilitating heat transfer from electronic elements to fins for dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high efficiency LEDs are used to enhance emitting luminance, then light emitting efficiency is improved, but heat generation increases
Solution Approach 1:
The lamp cover is divided into multiple spaces (first space for LED assembly, second space for control circuit board) separated by an interlayer, allowing independent heat management for different heat-generating components
Solution Approach 2:
Heat conducting tabs act as intermediary structures that thermally connect the control circuit board to the heat dissipating lamp cover, facilitating heat transfer from the control circuit to the external environment
2Device complexity
If control circuit board is integrated into the lamp structure, then device compactness is improved, but heat accumulation occurs on the control circuit board
Solution Approach 1:
The lamp cover is segmented into multiple functional spaces with an interlayer, creating dedicated zones for LED assembly and control circuit board while maintaining structural integration
Solution Approach 2:
Heat conducting tabs serve as thermal intermediaries that bridge the control circuit board and the heat dissipating lamp cover, enabling effective heat transfer without compromising structural integration
3Temperature
If heat dissipation structure is added to the lamp cover, then heat dissipation capability is improved, but device complexity increases
Solution Approach 1:
The lamp cover serves multiple functions: it protects internal components, provides structural support, and acts as a heat dissipation structure through integrated fins, eliminating the need for separate heat sink components
Solution Approach 2:
The heat dissipation fins are merged with the lamp cover structure itself, combining the protective housing and thermal management functions into a single integrated component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat from both LEDs and control circuit board components, preventing heat accumulation and extending the LED's service life by maintaining a lower overall temperature.
Implementation Method 1
The heat conducting tab has a heat conducting surface corresponding to the electronic element to thermally contact with the electronic element
Implementation Method 2
The lamp cover is made of heat dissipating material
Data Source
AI summary
A lamp with heat conducting structure includes a lamp cover made of heat dissipating material. The lamp cover has a hollow configuration therein. An interlayer is horizontally arranged in the lamp cover. The lamp cover is divided into a first space and a second space therein by the interlayer. A LED lamp assembly is disposed in the first space of the lamp cover. A power plug is disposed in the second space of the lamp cover. The power plug has a control circuit board in the second space. The control circuit board has an electronic element disposed thereon. A heat conducting tab protrudes from the interlayer of the lamp cover towards the second space. The heat conducting tab has a heat conducting surface corresponding to the electronic element to thermally contact with the electronic element.