Lamp Filament Design for Angular Temperature Uniformity
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Solution Overview
Problem
Current lamp arrangements in semiconductor processing chambers suffer from non-uniform temperature control around angular locations of substrates during rapid thermal processing, leading to potential substrate damage and inefficiencies.
Innovation Solution
The implementation of a lamp heating system with segregated lamp assemblies based on specific characteristics such as filament length, number of coils, and positioning, allowing for targeted infrared radiation control through individual electric driving circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If hundreds or thousands of lamps are used in honeycomb arrangement, then fine temperature control is achieved, but cost increases
Solution Approach 1:
The patent implements parameter changes by modifying the coil count of lamps in different assemblies rather than increasing the total number of lamps. Each lamp assembly has a specific number of coils (e.g., 10, 15, or 20 coils) tailored to its angular position. This approach achieves fine temperature control through parameter variation of existing lamps instead of adding numerous lamps, thereby maintaining cost-effectiveness.
2Ease of manufacture
If filament length and positioning are standardized across all lamps, then manufacturing is simplified, but angular temperature uniformity deteriorates
Solution Approach 1:
The patent applies local quality by differentiating filament characteristics across lamp assemblies based on their angular positions. Lamps in different assemblies have different filament lengths and positioning (e.g., first filament length of 50mm positioned 10mm from envelope end, second filament length of 75mm positioned 15mm from envelope end). This localized customization of filament parameters ensures uniform angular temperature distribution while maintaining relatively simple manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances temperature uniformity across substrates, reducing thermal stress-induced damage and increasing substrate throughput while minimizing hardware redesign and costs.
Implementation Method 1
two or more lamp assemblies operable to provide radiant energy to heat a substrate
Implementation Method 2
the second envelope includes an opaque portion positioned a fourth distance from the first end
Data Source
AI summary
Methods and apparatus disclosed herein generally relate to lamp heating of process chambers used to process semiconductor substrates. More specifically, implementations disclosed herein relate to arrangement and control of lamps for heating of semiconductor substrates. In some implementations of the present disclosure, fine-tuning of temperature control is achieved by dividing different lamps within an array of lamps into various subgroups or lamp assemblies defined by a specific characteristic. These various subgroups may be based on characteristics such as lamp design and/or lamp positioning within the processing chamber.