Lamp Heat Dissipation System for Vehicle Headlamps
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Solution Overview
Problem
Conventional vehicle head lamps with digital micro-mirror device (DMD) chips face issues of increased size, heat dissipation challenges, and vulnerability to external vibrations due to separate heat dissipation systems for LEDs and DMD chips, leading to inefficiencies in assembly and optical performance.
Innovation Solution
A lamp heat dissipation system that integrates a single LED with the DMD module, using a dual heat dissipation structure with a flat fixing plate and spring-type elastic mounting to stabilize the DMD element, and a heat sink configuration that reduces module size and improves heat dissipation efficiency while preventing vibration and impact transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple LED light sources are used to illuminate the DMD chip, then design freedom and illumination coverage are improved, but the number of collimator lenses increases, overall package size increases, and separate heat dissipation systems are required for each LED and DMD chip
Solution Approach 1:
The patent merges multiple LED light sources into a single LED configuration while maintaining illumination coverage through optimized optical path design. The single LED works with a combination of reflectors and refractive lenses to achieve the same lighting distribution as multiple LEDs would provide, thereby reducing the number of collimator lenses from multiple to one.
Solution Approach 2:
The single LED is designed to serve multiple functions: providing illumination for the DMD chip, acting as a heat source for the unified heat dissipation system, and enabling the optical system to achieve the performance of multiple LEDs with fewer components. This multi-functional approach reduces overall system complexity.
2Area of stationary object
If multiple LED light sources are spaced apart from each other, then illumination coverage is improved, but light energy is lost and optical performance decreases due to each LED light being dissipated
Solution Approach 1:
The patent combines the light paths from what would be multiple LEDs into a single optical path. By using a single LED positioned strategically with optimized reflectors and refractive lenses, the system achieves the same illumination coverage while preventing light energy dispersion that occurs with multiple spaced-apart LEDs.
Solution Approach 2:
The optical system uses segmented reflectors and refractive lenses that divide and redirect the single LED's light path to cover the necessary area. This segmentation of the optical path achieves wide illumination coverage without requiring multiple light sources, thereby preventing energy loss.
3Temperature
If separate heat dissipation systems are required for each LED and DMD chip, then heat dissipation effectiveness is improved, but device complexity and assembly complexity increase
Solution Approach 1:
The patent merges the heat dissipation functions for the LED and DMD chip into a single unified heat dissipation system. The heat dissipation structure is designed to simultaneously manage heat from both the LED and the DMD chip through thermal conduction paths that converge on a common heat sink or cooling mechanism, thereby reducing system complexity while maintaining effective heat dissipation.
Solution Approach 2:
The unified heat dissipation system uses thermal conduction materials and heat dissipation structures as intermediaries to transfer heat from both the LED and DMD chip to the external environment. This intermediary approach allows effective heat dissipation for multiple components through a single integrated system rather than separate systems.
4Reliability
If a compression spring with screw or pin is used to mount the DMD chip, then the DMD chip can be secured, but assembly efficiency and mass production capability are reduced
Solution Approach 1:
The patent replaces the traditional mechanical mounting system (screw or pin with compression spring) with an adhesive bonding system. The DMD chip is mounted on the heat dissipation structure using adhesive, which eliminates the need for complex mechanical fastening components and simplifies the assembly process, thereby improving assembly efficiency and suitability for mass production while maintaining secure chip attachment.
5Temperature
If the DMD chip is directly mounted on the heat sink, then heat dissipation is improved, but vibration and impact are directly transmitted to the DMD chip
Solution Approach 1:
The patent introduces a vibration isolation layer as an intermediary between the heat dissipation structure and the DMD chip. This layer serves dual functions: it maintains thermal contact for effective heat dissipation while simultaneously isolating the DMD chip from vibration and impact transmitted through the mounting structure, thereby protecting the chip from harmful mechanical stresses.
Solution Approach 2:
The vibration isolation layer is implemented as a flexible material or thin film that can accommodate mechanical vibrations and impacts while maintaining thermal conductivity. This flexible intermediary layer absorbs mechanical stresses and prevents them from reaching the DMD chip, while still allowing heat to be effectively dissipated from the chip to the heat sink.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the overall size of the lamp system, enhances optical performance, and provides a more stable and efficient heat dissipation mechanism, minimizing light energy loss and improving assembly efficiency.
Implementation Method 1
a heat dissipation unit dissipating heat from the illumination optical system to the outside
Implementation Method 2
heat dissipation unit dissipating heat from the illumination optical system to the outside
Implementation Method 3
a mounting structure using a spring-type elastic feature provided on the fixing plate
Implementation Method 4
a protruding contact part preventing the DMD module from being in full contact with the heat sink to prevent vibration and impact from being directly transmitted to the DMD module
Implementation Method 5
an illumination optical system including a light source
Data Source
AI summary
A lamp system, and more particularly, a lamp heat dissipation system including a heat dissipation function. The lamp heat dissipation system may reduce a module size and improve optical performance by including one light emitting diode (LED) and reducing a distance between a light source and a digital micro-mirror device (DMD) module, and a distance between the DMD module and a projection optical system, and may reduce the module size and improve heat dissipation performance by configuring the LED and the DMD module to dissipate heat as one heat dissipation structure.