Vehicle Lamp Heat Sink Segmentation for Wire Light Blockage
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Solution Overview
Problem
Conventional semiconductor optical modules face the challenge of bonding wires obstructing light emission from the light source due to their connection method, which is not adequately addressed in existing technologies.
Innovation Solution
A vehicle lamp design where the heat sink is divided into two regions, with the light emitting portion fixed to one region and the circuit board to another, allowing bonding wires to be positioned between the light emitting surface and the circuit board, preventing obstruction while enhancing heat dissipation through a heat sink structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires are used to electrically connect the semiconductor light source to the circuit board, then electrical connection is achieved, but the bonding wires may block light emitted from the light emitting surface
Solution Approach 1:
The patent positions the light emitting portion and circuit board at different heights (vertical dimension), with the light emitting portion located higher than the circuit board. This vertical arrangement allows bonding wires to connect the two components without extending across the light emitting surface, thus preventing light blockage while maintaining electrical connection.
2Volume of moving object
If the light emitting portion and circuit board are positioned close together, then device compactness is improved, but heat dissipation from the light emitting portion may be insufficient
Solution Approach 1:
The patent divides the heat sink into multiple regions: a first heat dissipation region positioned behind the light emitting portion and a second heat dissipation region positioned behind the circuit board. This segmentation allows each region to independently dissipate heat from its respective component, improving overall heat dissipation efficiency while maintaining compact device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents bonding wires from blocking light emission while improving heat dissipation performance by utilizing a heat sink with distinct regions for the light emitting portion and circuit board, ensuring efficient light transmission and thermal management.
Implementation Method 1
a heat sink (4). A front region of the heat sink (4) is divided into a first region (41) and a second region (42), the light emitting portion (31) is fixed to the first region (41), and the circuit board (32) is fixed to the second region (42)
Data Source
AI summary
To provide a vehicle lamp in which it is possible to prevent a bonding wire from blocking light emitted from a light emitting surface while improving heat dissipation performance from a light emitting portion. A vehicle lamp includes a light emitting portion having a light emitting element, a circuit board, and a heat sink. In this vehicle lamp, a front region of the heat sink is divided into a first region and a second region, the light emitting portion is fixed to the first region, and the circuit board is fixed to the second region. A light emitting portion-side terminal provided in the light emitting portion and a board-side terminal provided in the circuit board are electrically connected by a bonding wire. The light emitting portion-side terminal is disposed between a light emitting surface that covers the light emitting element, and the board-side terminal in front view.