Lamp Heater Shutter Control for Uniform IPL Package Soldering
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Solution Overview
Problem
The intense pulsed light (IPL) method for soldering electronic devices can cause uneven temperature gradients, leading to issues like tombstone defects and tilting due to rapid heating and cooling variations across the package, which are not effectively addressed by conventional methods.
Innovation Solution
A method using a lamp heater with a shutter mechanism to control light irradiation in sequential regions, ensuring equal exposure times for each package, minimizing temperature gradients by selectively blocking light during entry and exit from irradiation zones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If IPL method is used for soldering, then process time is shortened and power consumption is reduced, but temperature gradient increases causing tombstone defects and tilting
Solution Approach 1:
The irradiation system is divided into multiple independent irradiation regions (first, second, and third regions) along the movement direction. Each region can be controlled independently through shutters, allowing differential heating strategies for different spatial zones to achieve uniform temperature distribution across the package.
Solution Approach 2:
Different regions of the package receive different irradiation conditions. The shutter mechanism selectively blocks light to specific regions based on their position and thermal state, creating localized thermal profiles that compensate for heat accumulation and maintain overall temperature uniformity.
2Power
If light irradiation is applied continuously, then heating efficiency is high, but temperature gradient increases due to position-dependent heating rates
Solution Approach 1:
The shutter mechanism periodically blocks and releases light irradiation to different regions in a cyclic manner. This periodic control allows regions that are heating too rapidly to be temporarily blocked, while other regions continue to receive irradiation, thereby equalizing the temperature rise across the package over time.
Solution Approach 2:
The shutter proactively blocks light irradiation to regions that are at risk of overheating or developing excessive temperature gradients before the problem occurs. By predicting and preventing temperature imbalance, the system maintains uniform heating without requiring corrective actions after defects occur.
3Productivity
If multiple packages are processed sequentially, then throughput is improved, but temperature control complexity increases
Solution Approach 1:
The processing system is segmented into multiple irradiation regions that can handle multiple packages simultaneously or in sequence. Each region operates with its own shutter control, allowing independent temperature management for each package while maintaining overall system efficiency and throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents temperature gradients and associated defects by equalizing light exposure times, ensuring consistent heating and preventing tilting or vertical standing of electronic devices during the soldering process.
Implementation Method 1
the light-emitting portion is configured to irradiate with light a first irradiation region, a second irradiation region, and a third irradiation region
Implementation Method 2
the shutter portion includes a first shutter configured to block the light to the first irradiation region and a second shutter configured to block the light to the third irradiation region
Implementation Method 3
cause the electronic device to stand vertically due to surface tension of the molten solder balls
Data Source
AI summary
In a method of soldering electronic devices, a lamp heater may be provided, the lamp heater including a light-emitting portion and a shutter portion, wherein the light-emitting portion is configured to irradiate a first irradiation region, a second irradiation region, and a third irradiation region sequentially arranged in a first direction, wherein the shutter portion provides a first shutter configured to block light to the first irradiation region and a second shutter configured to block light to the third irradiation region. A package array may be disposed on a substrate supply actuator, wherein the package array includes a first package and a second package that are sequentially disposed along the first direction. The substrate supply actuator may be moved in the first direction to sequentially pass the package array through the first irradiation region, the second irradiation region and the third irradiation region. Soldering processes may be performed on the first package and the second package by selectively blocking the light to the first irradiation region and the light to the third irradiation region when the first package and the second package moves through the first irradiation region, the second irradiation region, and the third irradiation region.