Lamp Heater Substrate Transfer System for Moisture Removal

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Solution Overview

Problem

Existing substrate transfer systems face inefficiencies in removing moisture from the inner walls of transfer chambers, particularly in thermal CVD processes, where water molecules adhere to the chamber surfaces, hindering process efficiency.

Innovation Solution

A substrate transfer system with a chamber design featuring through holes and strategically placed lamp heaters, which are integrated into concave parts on the chamber walls with reflective surfaces, allowing for direct and uniform heating of the inner walls and substrate transfer devices, facilitating rapid moisture removal through controlled vacuum exhaust.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a lamp heater is used to heat the transfer chamber, then moisture removal efficiency is improved, but power consumption increases

Engineering Contradiction:
Improvemoisture removal efficiencyVSAvoidpower consumption
Core Design Contradiction:
ProductivityVSUse of energy by moving object

Solution Approach 1:

The lamp heater is positioned to provide localized heating directly at the chamber wall surfaces where moisture adheres, rather than heating the entire chamber volume. This concentrated local heating achieves effective moisture removal while minimizing overall power consumption by targeting only the critical areas needing temperature elevation.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent replaces conventional thermal conduction heating mechanisms with radiant heating from the lamp heater. This substitution enables more direct and efficient energy transfer to the chamber walls, improving moisture removal efficiency while reducing the total energy required compared to traditional heating methods.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Speed

If the chamber is heated to remove moisture, then moisture removal speed is improved, but heating time increases

Engineering Contradiction:
Improvemoisture removal speedVSAvoidheating time
Core Design Contradiction:
SpeedVSDuration of action of moving object

Solution Approach 1:

By concentrating heating power at the chamber wall surfaces through strategically positioned lamp heaters, the system achieves rapid local temperature elevation where moisture is present. This localized approach accelerates moisture removal speed without requiring prolonged heating of the entire chamber, thus reducing total heating time.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The lamp heater operates in periodic cycles, delivering intense heating pulses when moisture removal is needed, then allowing cooling periods. This periodic operation maintains high moisture removal speed during active heating while reducing average heating time and overall energy consumption.

Inventive Principle:
Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables rapid and efficient removal of moisture from the chamber and substrate transfer devices, reducing moisture levels within minutes compared to traditional methods, while minimizing power consumption and ensuring uninterrupted substrate handling.

Implementation Method 1

a lamp heater disposed in the chamber

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 2

efficiently remove water molecules adhering to the inner wall of this transfer chamber

Methodology Applied
Scientific EffectEvaporation: Evaporation

Data Source

PatentUS20230022174A1Substrate transfer system with lamp heater, chamber purge method
Publication Date: 2023.01.26 ASM IP HLDG BV
  • US20230022174A1 patent drawing
  • US20230022174A1 patent drawing
  • US20230022174A1 patent drawing

AI summary

Examples of a substrate transfer system include a chamber in which a plurality of through holes are formed on a side surface, a substrate transfer device provided in the chamber, and a lamp heater disposed in the chamber. The lamp heater is configured to heat an inner wall of the chamber and the substrate transfer device.