Lamp Holder Thermal Path for Cooler Substrate Heating Modules

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Solution Overview

Problem

Existing substrate heating methods using lamp heaters face challenges in easily inserting and removing the lamp holder while minimizing the increase in temperature of the holder during light emission.

Innovation Solution

A configuration that includes a holder with a thermal attenuator and heat conduction path to attenuate heat generated by the lamp, using a non-contact insertion structure and a support to manage heat transfer, allowing easy insertion and removal of the lamp holder.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the lamp holder is directly inserted into the housing without thermal management, then the insertion and removal operation is simple, but the temperature of the holder increases significantly when the lamp emits light

Engineering Contradiction:

Improveease of insertion and removalVSAvoidtemperature of holder

Core Design Contradiction:

Ease of operationVSTemperature

Solution Approach 1:

A holder is introduced as an intermediary component between the lamp and the housing. The holder includes a heat conduction path that directs heat away from the lamp holder body, and a thermal attenuator that reduces heat transfer to the housing. This mediator structure allows easy insertion and removal while managing temperature through dedicated thermal management features.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal management system is segmented into distinct functional components: the holder body, the heat conduction path, and the thermal attenuator. This segmentation allows each component to perform its specific thermal function independently while maintaining overall system simplicity for insertion and removal operations.

Inventive Principle:

Principle #1Segmentation

2Temperature

If thermal management structures are added to the lamp holder, then the temperature increase is suppressed, but the device complexity increases

Engineering Contradiction:

Improvetemperature of holderVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The thermal management features (heat conduction path and thermal attenuator) are merged into the holder structure itself rather than being separate components. The holder integrates multiple functions: mechanical support, heat conduction, and thermal attenuation, reducing overall device complexity while maintaining effective temperature control.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

Thermal management is applied locally where needed - the heat conduction path is positioned to conduct heat from the lamp, and the thermal attenuator is placed between the holder and housing to reduce heat transfer. This localized approach provides effective temperature control without adding complexity to the entire device.

Inventive Principle:

Principle #3Local quality

3Temperature

If the holder is made with high thermal conductivity material for heat dissipation, then heat transfer to housing increases, but the holder temperature decreases

Engineering Contradiction:

Improvetemperature of holderVSAvoidheat transfer to housing

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The thermal attenuator serves as a mediator between the holder and the housing. It is positioned to intercept heat flow from the holder to the housing and attenuate (reduce) this heat transfer. This allows the holder to maintain low temperature through the heat conduction path while preventing excessive heat loss to the housing through the thermal attenuator.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses temperature increases in the holder and facilitates easy lamp insertion and removal, ensuring efficient substrate heating.

Implementation Method 1

attenuating a heat generated by the light radiated from the lamp by a thermal attenuator provided at a location of a first structure facing the lamp

Methodology Applied

Scientific EffectHeat absorption: Absorption (EM radiation)

Implementation Method 2

forming a heat conduction path of a heat of the storage to a housing via the first structure, a second structure provided at the holder and a support of the housing

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 3

a lamp capable of radiating a light to heat the substrate

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS20250273488A1Heating Method, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, Lamp Module, Method of Processing Substrate and Non-transitory Computer-readable Recording Medium

Publication Date: 2025.08.28 KOKUSAI DENKI KK

AI summary

There is provided a technique that includes: (a) loading a substrate into a process chamber; (b) operating a heater including a lamp radiating a light and a storage storing a wiring; attenuating a heat from the lamp by a thermal attenuator at a first structure facing the lamp, wherein the first structure is provided at a holder and covers an outer periphery of the storage; and forming a heat conduction path of heat of the storage to a housing via the first structure, a second structure provided at the holder and a support of the housing, wherein the second structure protrudes outward from the first structure opposite to the lamp, and the housing is provided above the process chamber and includes an insertion structure where the first structure is inserted without contact, and the support for the second structure; and (c) heating the substrate by the heater.