Semiconductor Lamp Injection Channel Encapsulation

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Solution Overview

Problem

Existing methods for encapsulating the driver in semiconductor lamps, such as 'potting' and 'pre-potting', either restrict the assembly process or require additional molding tools, limiting electrical connections and increasing manufacturing complexity.

Innovation Solution

A semiconductor lamp design with injection channels in the housing allows for encapsulation of components after assembly, using a heat-conducting encapsulation material to secure and dissipate heat, while also providing improved vibration resistance and moisture insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the driver is encapsulated before being inserted into the cavity (pre-potting), then the driver is protected against moisture and vibrations, but an additional molding tool is required and the driver must be inlaid in a preceding intermediate step

Engineering Contradiction:

Improveprotection against moisture and vibrationsVSAvoidadditional molding tool and intermediate steps

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The driver and light fixture are assembled and electrically connected in advance before being inserted into the cavity. The encapsulation material is then injected through channels in the housing to encapsulate the driver in situ, eliminating the need for pre-encapsulation in a separate molding tool while still providing protection against moisture and vibrations

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The encapsulation process is extracted from the traditional pre-potting method and repositioned to occur in situ within the housing cavity. This is achieved by providing injection channels in the housing that allow encapsulation material to be delivered directly to the driver location after assembly, removing the requirement for additional molding tools

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If the light fixture and lens are attached after encapsulation material is introduced, then the driver is protected early, but electrical connections between the light fixture printed circuit board and driver cannot be made before installation

Engineering Contradiction:

Improvedriver protectionVSAvoidelectrical connection process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The light fixture, printed circuit board, and driver are assembled and electrically connected in advance before being inserted into the housing cavity. The housing is then closed and encapsulation material is injected through channels to protect the driver, allowing electrical connections to be made early in the manufacturing process

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The housing serves as an intermediary structure that provides injection channels for delivering encapsulation material to the driver after the light fixture and driver are assembled and connected. This mediator structure enables both early electrical connections and subsequent driver protection

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If the housing is substantially closed before encapsulation, then the cavity is protected from external contaminants, but encapsulation material cannot be introduced without additional openings

Engineering Contradiction:

Improvecavity protection from contaminantsVSAvoidinjection channel structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The housing is segmented to include integrated injection channels that are formed as part of the housing structure itself. These channels provide pathways for encapsulation material to reach the driver while maintaining the substantially closed structure of the housing, protecting the cavity from external contaminants

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The injection channels serve multiple functions: they allow encapsulation material to be delivered to the driver while maintaining the closed structure of the housing for protection against contaminants. The channels are integrated into the housing structure, combining protection and encapsulation delivery functions

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables complete assembly of the lamp before encapsulation, enhances heat dissipation, and improves resistance to impacts and moisture, simplifying the manufacturing process and reducing costs.

Implementation Method 1

When the encapsulation material according to a preferred embodiment is heat-conducting, heat produced on the driver during the operation of the semiconductor lamp can be dissipated, at least by the parts of the driver which are in heat-conducting contact with the encapsulation material.

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10495266B2Semiconductor lamp and method for producing a semiconductor lamp

Publication Date: 2019.12.03 LEDVANCE GMBH

AI summary

A semiconductor lamp includes a housing with a cavity to accommodate a light source, preferably an LED, and a driver for the light source. The housing has at least one injection channel for injection of an encapsulation material into the cavity of the housing. A semiconductor lamp is produced by providing a housing with a cavity and inserting a driver and a light source into the cavity. Following the insertion of the driver and the light source into the cavity, an encapsulation material is introduced into at least a part of the cavity through at least one injection channel of the housing.