Lamp Module with Integrated LED and Current-Limiting Circuit
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Solution Overview
Problem
Traditional lighting devices such as incandescent and fluorescent bulbs have issues like quick attenuation, high power consumption, heat generation, fragility, and non-recyclability, which are not addressed by existing LED solutions that often require external driving circuits.
Innovation Solution
A lamp module design that integrates a cover structure, circuit board, and multichip package structure without an external driving circuit, featuring conductive pins, light-emitting diodes (LEDs), and resin bodies for light reflection and transmission, allowing for assembly as a single module with parallel and series connections of LEDs and current-limiting chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If traditional lighting devices (incandescent bulbs, fluorescent bulbs) are used, then illumination function is achieved, but power consumption is high and heat generation is high
Solution Approach 1:
The patent replaces traditional incandescent and fluorescent lighting systems with LED (light-emitting diode) technology. LEDs convert electrical energy directly to light through electroluminescence, eliminating the need for heating elements and fluorescent gas excitation, thereby dramatically reducing power consumption and heat generation while maintaining illumination functionality.
Solution Approach 2:
The patent changes the fundamental operating parameters of the lighting system by transitioning from high-power traditional bulbs to low-power LED chips. This parameter change includes operating voltage, current consumption, and temperature characteristics, enabling the lighting module to achieve the same illumination output with significantly lower energy input.
2Duration of action of stationary object
If traditional lighting devices are used, then illumination function is achieved, but working life is short
Solution Approach 1:
The patent replaces traditional lighting systems with LED technology, which has inherently longer operational lifespan. LED chips can operate for tens of thousands of hours without significant degradation, compared to the limited life of incandescent filaments or fluorescent tubes, thereby extending the working life while maintaining illumination performance.
Solution Approach 2:
The patent incorporates a silicon rubber cushion between the LED chip and the circuit board to provide mechanical protection and shock absorption. This cushioning element protects the LED chips from physical damage during assembly and operation, thereby extending their working life and preventing premature failure.
3Use of energy by moving object
If LED package structures are created to replace traditional lighting devices, then power consumption is reduced, but device complexity increases due to external driving circuits
Solution Approach 1:
The patent merges the LED chip, current-limiting chip, and circuit board into a single integrated lighting module. The LED chip is directly mounted on the circuit board with the current-limiting chip, eliminating the need for separate external driving circuits. This integration maintains the low power consumption benefits of LEDs while simplifying the overall device structure.
Solution Approach 2:
The circuit board in the patent serves multiple functions: it provides electrical connections, houses the current-limiting chip, and acts as a mounting substrate for the LED chip. This multi-functionality eliminates the need for dedicated external driving circuits, reducing device complexity while maintaining efficient power management.
4Illumination intensity
If LED chips are exposed without packaging, then light transmission efficiency is improved, but reliability decreases due to fragility
Solution Approach 1:
The patent uses a silicon rubber cushion as a flexible protective element between the LED chip and the circuit board. This thin film provides mechanical protection and shock absorption without significantly blocking light transmission, thereby maintaining reliability while preserving light transmission efficiency.
Solution Approach 2:
The patent incorporates a silicon rubber cushion to provide beforehand protection for the LED chip against mechanical shocks and vibrations during assembly and operation. This cushioning element prevents physical damage to the fragile LED chip while being transparent enough to allow efficient light transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and compact LED lighting without external driving circuits, reducing power consumption and heat generation, while enhancing light transmission and color rendering, and allowing for recyclability.
Implementation Method 1
a surrounding light-reflecting surface formed on the inner surface of the through opening
Implementation Method 2
the frame unit includes a surrounding light-reflecting resin body surroundingly coated on the top surface of the substrate body and exposed by the through opening
Implementation Method 3
the package unit includes a light-transmitting resin body disposed on the top surface of the substrate body and exposed by the through opening, and the light-transmitting resin body is disposed in the resin position limiting space to cover the LED bare chips
Implementation Method 4
the light-emitting unit includes a plurality of LED bare chips disposed on the top surface of the substrate body and exposed by the through opening
Data Source
AI summary
A lamp module includes a cover structure, a circuit board structure and a multichip package structure, and the circuit board structure and the multichip package structure are sequentially assembled on the bottom side of the cover structure. The cover structure includes a cover body, a plurality of positioning elements disposed on the bottom side of the cover body, and a plurality of retaining elements disposed on the bottom side of the cover body. The cover body has a through opening and a surrounding light-reflecting surface formed on the inner surface of the through opening. The circuit board structure is disposed on the bottom side of the cover body and includes a plurality of conductive pins disposed on the bottom side of the circuit board structure. The multichip package structure is disposed on the bottom side of the cover body and electrically connected to the circuit board structure.