Solid State Lamp Thermal Handling System

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Solution Overview

Problem

Existing solid state light emitting lamps face challenges in effectively dissipating heat generated during operation, which affects their efficiency and longevity.

Innovation Solution

The lamp design incorporates a thermal handling system with a heat sink and a multi-surfaced three-dimensional thermal core, along with a heat transfer element that supports solid state light emitters in orientations to mimic the light distribution of incandescent lamps, allowing for efficient heat dissipation through a combination of thermal conductivity and air passages.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If increased output power is used in solid state light emitting sources, then light output is improved, but heat generation increases making dissipation more difficult

Engineering Contradiction:
Improveoutput powerVSAvoidheat generation
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The patent transitions from traditional planar heat dissipation structures to a three-dimensional thermal core with multi-directional heat transfer pathways. The thermal core extends in multiple dimensions with heat transfer elements positioned at different spatial locations and orientations, enabling heat to dissipate through multiple dimensional pathways simultaneously, thereby effectively managing heat from high-power solid state light emitting sources.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The thermal management system is divided into multiple discrete heat transfer elements distributed throughout the structure. Rather than a single centralized heat sink, the system uses multiple segmented heat transfer components that can independently manage heat from different regions, improving overall heat dissipation efficiency and allowing better thermal control of high-power emitters.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If traditional heat dissipation structures are used, then manufacturing is simpler, but heat dissipation effectiveness is insufficient

Engineering Contradiction:
Improvestructural simplicityVSAvoidheat dissipation effectiveness
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The thermal core serves multiple functions simultaneously: it provides structural support for the solid state light emitting sources, acts as a heat conduction pathway, and functions as a mounting platform for heat transfer elements. This multi-functional design achieves effective heat dissipation without significantly increasing manufacturing complexity, as the same structural component performs multiple roles.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Illumination intensity

If solid state light emitters are oriented to maximize light output, then illumination is improved, but heat concentration increases

Engineering Contradiction:
Improvelight outputVSAvoidheat concentration
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The patent implements localized thermal management by positioning heat transfer elements in specific locations adjacent to individual solid state light emitting sources. Each heat transfer element is locally optimized to manage heat from its associated emitter, allowing light-emitting surfaces to be oriented for maximum illumination while heat is simultaneously managed at each local source through dedicated thermal pathways.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the lamps' ability to dissipate heat, improving their energy efficiency and extending the operational life of the solid state light emitters while maintaining a desirable light output similar to incandescent lamps.

Implementation Method 1

A thermal transfer element of the thermal handling system is coupled to the thermal core and the heat sink. The heat transfer element supports the thermal core, with the solid state emitters, within the interior of the bulb; and that element transfers heat generated by the solid state light emitters from the thermal core to the heat sink.

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

A thermal handling system of the lamp includes a heat sink and a thermal core made of a thermally conductive material

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

A thermal handling system of the lamp includes a heat sink and a thermal core made of a thermally conductive material

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS8272766B2Semiconductor lamp with thermal handling system
Publication Date: 2012.09.25 ABL IP HLDG LLC
  • US8272766B2 patent drawing
  • US8272766B2 patent drawing
  • US8272766B2 patent drawing

AI summary

A lamp, for general lighting applications, utilizes solid state light emitting sources to produce and distribute white light. The exemplary lamp also includes elements to dissipate the heat generated by the solid state light emitting sources. The lamp includes a thermal handling system having a heat sink and a thermal core made of a thermally conductive material to dissipate the heat generated by the solid state light emitting sources to a point outside the lamp.