Lamp Unit Thermal Conductive Plate Mounting
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Solution Overview
Problem
Existing vehicle lamp units using LEDs are costly due to the need for thermally-conductive ceramic power feeding boards and complex attachments, which increase the number of parts and complicate the structure, while compromising on heat dissipation and light distribution characteristics.
Innovation Solution
A lamp unit design featuring a thermally-conductive metal plate with a circuit board and light emitting element, where the optical system is mounted at a predetermined position relative to the light emitting element, reducing the number of parts and using laser processing for precise hole drilling to enhance positional accuracy and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermally-conductive ceramic power feeding board is used to feed power to the LED and improve heat dissipation, then the heat dissipation effect is improved, but the cost increases and the structure becomes more complex
Solution Approach 1:
The patent combines the power feeding board and heat sink into a single integrated component. The aluminum heat sink incorporates circuit board support structures, wiring channels, and electrical connection points directly into its body, eliminating the need for a separate ceramic power feeding board while maintaining both electrical conductivity and thermal dissipation functions
Solution Approach 2:
The aluminum heat sink is designed to perform multiple functions simultaneously: it serves as a thermal management component, a structural support for the circuit board, a pathway for wiring, and an electrical connection element. This multi-functional design replaces the specialized ceramic power feeding board with a universal component that accomplishes all necessary functions
2Illumination intensity
If an attachment is provided to position and mount the LED module on the heat sink, then the light distribution characteristic is improved, but the number of parts increases and the structure becomes more complex
Solution Approach 1:
The patent integrates the positioning and mounting functions directly into the heat sink structure. The heat sink includes precisely formed recesses, ribs, and mounting surfaces that simultaneously provide mechanical support, thermal contact, and optical positioning for the LED module, eliminating the need for separate attachment components
Solution Approach 2:
The heat sink structure is designed to automatically position and secure the LED module through its inherent geometric features. The module's own structure engages with complementary features on the heat sink, allowing the system to self-assemble and self-position without requiring additional attachment mechanisms
3Reliability
If an attachment is used to form the wiring member for feeding power to the LED, then the electrical connection is achieved, but the structure is complicated and expensive
Solution Approach 1:
The patent integrates the wiring function directly into the heat sink by incorporating conductive channels and contact points within the aluminum structure. Power is transmitted through the heat sink's own body and integrated pathways, eliminating the need for separate attachment-based wiring members
Solution Approach 2:
The aluminum heat sink itself acts as an intermediary conductor for electrical power transmission. The material and structural design of the heat sink enable it to serve as both a thermal pathway and an electrical conduit, mediating between the power source and the LED through its inherent conductivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces costs, simplifies the structure, and maintains excellent heat dissipation and light distribution characteristics by using a metal plate as a heat sink and eliminating the need for ceramic power feeding boards, while improving the positional accuracy of the optical system relative to the light emitting element.
Implementation Method 1
the thermally-conductive plate is provided with a mounting portion for mounting the optical system
Implementation Method 2
The process of providing the mounting portion may include a process of drilling a hole by a laser processing
Data Source
AI summary
A lamp unit includes: a light source module; and an optical system for projecting light emitted from the light source module with a required light distribution. The light source module includes a thermally-conductive plate, a circuit board attached to the thermally-conductive plate, and a light emitting element mounted on the circuit board and powered via the circuit board. The thermally-conductive plate is provided with a mounting portion for mounting the optical system at a predetermined position with the light emitting element as a reference.