Semiconductor Light-Emitting Device Lamp Wiring Board Design
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Solution Overview
Problem
Lamps using semiconductor light emitting devices face reliability issues due to leakage current between electrode lines and reflection layers, leading to increased voltage and potential damage to the reflection layer, especially in high-temperature and high-humidity environments.
Innovation Solution
The lamp design includes a wiring board with multiple wiring electrodes, semiconductor light emitting devices connected between two wiring electrodes, and a reflection layer under the wiring board. The wiring electrodes are connected in series with the semiconductor light emitting devices, and at least one semiconductor light emitting device can be connected between two consecutive wiring electrodes. This configuration allows for a uniform voltage application to the reflection layer, minimizing voltage deviations and electrochemical reactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a reflection layer is provided under the wiring board to improve light extraction efficiency, then lighting performance is improved, but leakage current between electrode lines and the reflection layer causes voltage increase and metal peeling in high-temperature high-humidity environments
Solution Approach 1:
An insulating layer is introduced between the electrode lines and the reflection layer to prevent direct contact and eliminate leakage current. This intermediary layer blocks the harmful electrochemical reaction while allowing the reflection layer to maintain its light-extracting function, thus resolving the contradiction between improved lighting performance and device reliability
Solution Approach 2:
The harmful electrochemical reaction pathway is extracted and removed from the system by isolating the electrode lines from the reflection layer. The insulating layer effectively removes the leakage current issue while preserving the beneficial light reflection function
2Ease of operation
If electrode lines are disposed on the wiring board to connect semiconductor light emitting devices, then electrical connection is achieved, but voltage difference between electrode lines causes different voltage application to the reflection layer leading to metal peeling
Solution Approach 1:
The insulating layer ensures that the reflection layer is electrically isolated from electrode lines with different potentials, creating an equipotential condition at the reflection layer interface. This prevents voltage-driven electrochemical reactions that would cause metal peeling, while maintaining the electrical connection functionality of the electrode lines
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively minimizes metal peeling of the wiring electrodes and prevents deterioration of the lamp's reliability by ensuring a uniform voltage application to the reflection layer, reducing electrochemical reactions, and enhancing light uniformity.
Implementation Method 1
A light emitting diode (LED) itself, not a package, is a semiconductor light emitting device that converts current into light
Implementation Method 2
a reflection layer made of a metal material provided on a surface opposite to the light emitting direction of the semiconductor light emitting device
Data Source
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AI summary
A lamp according to an embodiment of the present invention may include a wiring board, a plurality of wiring electrodes disposed on the wiring board, a plurality of semiconductor light emitting devices connected between two wiring electrodes among the plurality of wiring electrodes, and a reflection layer of a metal material disposed under the wiring board, wherein the plurality of wiring electrodes are connected in series with each other by the plurality of semiconductor light emitting devices, and at least one of the plurality of semiconductor light emitting devices is connected between two consecutive wiring electrodes among the plurality of wiring electrodes.