Land-Side Package Substrate Cooling Through Board-Coupled Solder Layers

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Solution Overview

Problem

Thermal management challenges arise in semiconductor device packages due to the incorporation of silicon devices on the land-side of package substrates, particularly in maintaining effective cooling solutions compatible with current assembly processes and adhering to strict keep-out zones in surface mount technology.

Innovation Solution

Incorporation of a thermal management layer between the land-side semiconductor device and a circuit board, utilizing heat spreaders, thermal interface materials, and a structured assembly process that includes flux deposition and reflowing solder materials to create robust solder connections, ensuring efficient heat transfer and maintaining desired gap heights.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If silicon devices are added to the land-side of package substrates to increase computing power, then volumetric density and computing power are improved, but thermal management becomes more challenging

Engineering Contradiction:

Improvecomputing powerVSAvoidthermal management

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The patent introduces a thermal management layer in the vertical dimension between the land-side semiconductor device and the circuit board. This layered approach allows heat dissipation pathways to be established in the Z-direction (through the solder layer and thermal management layer) without interfering with the planar layout of computing devices on the land-side of the substrate.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a thermal management layer as an intermediary component between the land-side semiconductor device and the circuit board. This intermediate layer facilitates heat transfer from the high-power computing devices to the circuit board while maintaining electrical connections and mechanical integrity, effectively mediating the thermal challenge created by high-density device placement.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If thermal management layers are added to cool land-side devices, then heat dissipation is improved, but assembly process complexity increases due to strict keep-out zones

Engineering Contradiction:

Improveheat dissipationVSAvoidassembly process complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The thermal management layer is designed to perform multiple functions simultaneously: it provides thermal management for land-side devices, serves as a structural support layer, maintains mechanical integrity of the package, and accommodates electrical connections. This multi-functionality reduces the need for separate specialized components and simplifies the overall assembly process despite the added thermal management capability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of manufacture

If solder connections are used to attach thermal management layers, then assembly compatibility is improved, but solder material deformation may occur during reflow

Engineering Contradiction:

Improveassembly compatibilityVSAvoidsolder connection precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent employs composite material structures in the solder connections, combining solder alloy materials with appropriate mechanical and thermal properties. The composite nature of the solder joints provides both the flexibility needed to accommodate thermal expansion differences and the strength required to maintain precise connections during the reflow process, thus resolving the contradiction between assembly compatibility and manufacturing precision.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances thermal management by facilitating effective heat dissipation through the use of heat spreaders and solder connections, maintaining assembly integrity and compatibility with existing manufacturing processes.

Implementation Method 1

a thermal management layer between the land-side semiconductor device and a circuit board

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

reflowing solder materials to create robust solder connections

Methodology Applied

Scientific EffectMelting and solidification: Melting

Data Source

PatentUS20260005180A1Land-side die cooling of double-sided package substrates

Publication Date: 2026.01.01 INTEL CORP

AI summary

Semiconductor device assemblies that comprise a package substrate having semiconductor devices on two sides. A solder layer can thermally couple one or more semiconductor devices on a side of the package with a circuit board. Methods of manufacturing assemblies having a semiconductor device thermally coupled to a circuit board are also provided.