Laned Synthetic-Fiber Conveyor Belt for Gentle PCB Cleaning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increased temperature requirements and higher flux content in lead-free soldering processes, combined with the smaller size and increased density of electronic substrates, demand more time and energy for effective cleaning, and existing stainless steel mesh belts can damage delicate components during the cleaning operation.
Innovation Solution
A conveyor system with a top and bottom belt assembly, where one of the belts is made of heat-resistant synthetic fibers and secured with pins to create lanes, providing a secure and gentle transport mechanism for electronic substrates through a cleaning apparatus, with the ability to attach mesh material belts to conveyor belts using clips and pins to create multiple lanes for secure retention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If stainless steel mesh belts are used to transport electronic substrates, then the substrates can be conveyed through the cleaning machine, but delicate and sensitive components can be damaged during the cleaning operation
Solution Approach 1:
The patent changes the material parameter of the conveyor belt from rigid stainless steel mesh to flexible heat-resistant synthetic fiber mesh. This parameter change allows the belt to conform to the substrate and components, eliminating mechanical damage while maintaining conveyance functionality through the cleaning machine.
Solution Approach 2:
The patent uses composite construction by attaching the heat-resistant synthetic fiber mesh to a stainless steel belt substrate. This composite material provides both the gentleness of the flexible mesh for component protection and the structural integrity of the metal belt for reliable operation.
2Reliability
If lead-free soldering processes are used with higher flux content, then soldering performance is improved, but more time and energy are required to meet cleanliness standards
Solution Approach 1:
The patent changes the thermal parameter of the conveyor belt by using heat-resistant synthetic fibers that can withstand higher temperatures. This allows the cleaning process to operate at elevated temperatures that accelerate flux residue removal, reducing cleaning time and energy requirements while maintaining effective contamination removal.
3Productivity
If smaller, low-profile components are used to reduce substrate size, then electronic substrate density is improved, but components become more vulnerable to damage during cleaning
Solution Approach 1:
The patent changes the mechanical parameter of the conveyor belt from rigid to flexible by using heat-resistant synthetic fibers. This flexibility allows the belt to accommodate and support smaller, low-profile components without subjecting them to damaging forces, enabling high substrate density while protecting vulnerable components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures secure and damage-free transport and cleaning of electronic substrates by providing a heat-resistant and flexible conveyor system that can handle the increased demands of lead-free soldering processes, effectively removing contaminants while protecting sensitive components.
Implementation Method 1
One of the bottom belt assembly and the top belt assembly includes a mesh material belt fabricated from heat resistant synthetic fibers
Data Source
AI summary
A conveyor system is configured to transport the electronic substrates through cleaning modules of a cleaning apparatus. The conveyor system includes a first outer frame member, a second outer frame member, a bottom belt assembly disposed between the first outer frame member and the second outer frame member, and a top belt assembly spaced from the bottom belt assembly. The bottom belt assembly and the top belt assembly are configured to an electronic substrate therebetween to transport the electronic substrate along the conveyor system and through the at least one cleaning module. The bottom belt assembly or the top belt assembly includes a mesh material belt fabricated from heat resistant synthetic fibers. The conveyor system further includes a plurality of pins secured to the bottom belt assembly or the top belt assembly to create at least one lane along a length of the conveyor system.