Lanthanum Sputtering Target Grain Refinement
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Solution Overview
Problem
Lanthanum targets for sputtering develop spotty macro patterns on their surface during production, leading to uneven deposition and particle generation during sputtering, which complicates normal operation and reduces the effectiveness of the sputtering process.
Innovation Solution
The production process involves melting and casting lanthanum into an ingot, followed by knead forging and upset forging at 300 to 500°C to form a recrystallized structure with an average crystal grain size of 100 μm or less, and subsequent heat treatment and machining to prevent spotty macro patterns, allowing for uniform deposition and reduced particle generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional melting and casting methods are used to produce lanthanum targets, then the production process is simple, but spotty macro patterns appear on the surface leading to uneven deposition
Solution Approach 1:
The patent applies preliminary action by performing knead forging and upset forging at 300-500°C before final target formation to pre-establish a fine recrystallized grain structure. This preliminary structural preparation prevents spotty macro patterns from forming during subsequent machining and sputtering processes, achieving uniform surface deposition without requiring complex post-processing steps.
Solution Approach 2:
The patent changes physical parameters by controlling the forging temperature at 300-500°C and applying specific deformation conditions during knead forging and upset forging. These parameter changes induce recrystallization that reduces average grain size to 100 μm or less, transforming the material structure to eliminate spotty macro patterns while maintaining production feasibility.
2Manufacturing precision
If the crystal grain size is reduced to 100 μm or less through forging, then spotty macro patterns are inhibited, but the forging process becomes more complex
Solution Approach 1:
The patent achieves fine crystal grain control by changing the temperature parameter to 300-500°C during knead forging and upset forging. This temperature range is optimal for inducing recrystallization in lanthanum, reducing average grain size to 100 μm or less. The parameter change transforms a potentially complex grain refinement process into a manageable thermal-mechanical treatment.
Solution Approach 2:
The patent applies continuous useful action by sequentially performing knead forging followed by upset forging without interrupting the thermal-mechanical treatment. This continuous process maintains the lanthanum in the optimal temperature range for recrystallization, ensuring uniform fine grain structure throughout the target while simplifying the overall manufacturing workflow.
3Ease of operation
If lanthanum target is left in atmosphere, then handling is convenient, but oxidation occurs rapidly causing defective sputtering
Solution Approach 1:
The patent applies inert atmosphere by conducting the sputtering process in a vacuum or inert gas environment, preventing oxidation of the lanthanum target surface. This allows the target to be handled conveniently while maintaining sputtering quality, as the inert environment blocks oxygen from reacting with the reactive lanthanum surface during operation.
Solution Approach 2:
The patent applies preliminary action by performing thorough surface cleaning and activation of the lanthanum target before introducing it to the sputtering chamber. This preliminary surface preparation removes any initial oxidation or contamination, ensuring that the target begins sputtering with optimal surface conditions. The target is then quickly transferred to the vacuum environment to prevent re-oxidation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a lanthanum target with a recrystallized structure that inhibits spotty macro patterns, enabling uniform deposition and preventing particle generation during sputtering, thus improving the operational efficiency and effectiveness of the sputtering process.
Implementation Method 1
heat treatment at a temperature of 300 to 500°C to perform recrystallization
Implementation Method 2
lanthanum target for sputtering that has no spotty macro patterns on the surface
Data Source
AI summary
Provided are a lanthanum target for sputtering which has a recrystallized structure with an average crystal grain size of 100 μm or less and has no spotty macro patterns on the surface; and a method of producing a lanthanum target for sputtering, wherein lanthanum is melted and cast to produce an ingot, the ingot is subject to knead forging at a temperature of 300 to 500° C. and subsequently subject to hot upset forging to form the shape into a rough target shape, and this is additionally subject to machining to obtain a target. This invention aims to offer technology for efficiently and stably providing a lanthanum target for sputtering which has no spotty macro patterns on the surface, and a method of producing the same.