Lapped Flexible Circuit Board Interconnection via Through-Hole Conduction
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Solution Overview
Problem
Existing flexible circuit board structures face challenges in efficiently connecting increased numbers of signal transmission lines with decreasing conductive trace widths, leading to increased power consumption and inadequate grounding, while conventional solutions fail to meet these needs.
Innovation Solution
A lapping connection structure is formed by stacking a second flexible circuit board with a through hole onto a first board, filling the hole with an interconnecting conduction member such as silver, aluminum, or conductive paste to electrically connect solder pads and conductive traces, allowing for expanded signal, power, and grounding trace connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of signal transmission lines is increased, then the data transmission capacity is improved, but the power consumption increases
Solution Approach 1:
The patent combines multiple functions into a single integrated structure. The flexible circuit board integrates signal transmission, power supply, and grounding functions within one board structure, allowing multiple signal transmission lines to be implemented without proportionally increasing power consumption through shared power and ground resources
Solution Approach 2:
The patent transitions from planar two-dimensional layout to three-dimensional stacked configuration. Multiple flexible circuit boards are stacked vertically with conductive traces extending through holes between layers, enabling increased signal transmission capacity by utilizing the vertical dimension while maintaining compact form factor and efficient power management
2Quantity of substance
If the line width of conductive traces is decreased, then the number of signal transmission lines can be increased, but the manufacturing precision requirements increase
Solution Approach 1:
The patent uses through holes extending through the flexible circuit board to create vertical interconnections between stacked layers. This three-dimensional approach allows conductive traces to maintain adequate width for manufacturability while achieving high signal transmission capacity through multiple layers and vertical routing, avoiding the need for excessively narrow traces that would demand ultra-high manufacturing precision
3Reliability
If grounding traces are expanded, then the grounding effectiveness is improved, but the area occupied by grounding traces increases
Solution Approach 1:
The patent implements grounding traces that extend vertically through holes across multiple stacked flexible circuit boards. This three-dimensional grounding structure provides extensive grounding coverage and improved grounding effectiveness without occupying excessive area on any single board layer, as the grounding paths are distributed across multiple vertical levels
Solution Approach 2:
The patent combines grounding functions across multiple stacked flexible circuit boards into an integrated grounding system. Grounding traces on different layers are electrically connected through the stacking structure, creating a unified grounding network that improves overall grounding effectiveness while efficiently utilizing the available area across the stacked configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively forms connections between conductive traces of stacked flexible circuit boards, addressing the need for increased signal transmission lines, reduced trace widths, and expanded grounding, while managing power consumption.
Implementation Method 1
an interconnecting conduction member is filled in the through hole of the second flexible circuit board. The interconnecting conduction member electrically connects the second solder pad of the second flexible circuit board and the first solder pad of the first flexible circuit board
Data Source
AI summary
An interconnecting conduction structure for electrically connecting conductive traces of a lapped flexible circuit board is disclosed. The lapped flexible circuit board includes a first flexible circuit board and a second flexible circuit board. A through hole is formed in the second flexible circuit board and an interconnecting conduction member is filled in the through hole of the second flexible circuit board. The interconnecting conduction member is electrically connected to a second solder pad of the second flexible circuit board and a first solder pad of the first flexible circuit board in order to formed a lapped connection between conductive traces of the first flexible circuit board and the second flexible circuit board.