Laptop Heat Dissipation Assembly With Side-Outlet Fan Airflow
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Solution Overview
Problem
Conventional laptop computers struggle to effectively cool heat sources using vapor chambers due to inefficient transfer of cold air from fans to the vapor chamber, which results in reduced I/O openings when additional vents are added.
Innovation Solution
A heat dissipation assembly comprising a first fan, first fin assemblies, a second fan, second fin assemblies, a vapor chamber, and a heat dissipation sheet, where the second fan's side outlet directs cold air towards the first fan, allowing effective air guidance to the vapor chamber without reducing I/O openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional vents are added on the housing to transfer cold air to the vapor chamber, then the cooling efficiency is improved, but the number of I/O openings is reduced
Solution Approach 1:
The patent introduces a side outlet on the second fan that directs cold air laterally toward the first fan, creating a three-dimensional airflow path. This spatial reconfiguration allows cold air to reach the vapor chamber without requiring additional vents on the housing, thus maintaining I/O opening availability while improving cooling efficiency
Solution Approach 2:
The first fan acts as an intermediary component that receives cold air from the second fan's side outlet and directs it to the vapor chamber. This intermediary arrangement enables effective cold air transfer without modifying the housing structure or reducing I/O openings
2Device complexity
If the cold air from the fan is not effectively transferred to the vapor chamber, then the structure remains simple, but the cooling efficiency deteriorates
Solution Approach 1:
The patent employs dynamic airflow control by positioning the second fan's side outlet to actively direct cold air toward the first fan. This dynamic air guidance mechanism, combined with the fin assemblies, ensures effective cold air transfer to the vapor chamber without adding complex structural components
Solution Approach 2:
The cooling system is segmented into distinct functional modules: the second fan with side outlet for cold air generation, the first fan for air direction, the fin assemblies for heat transfer enhancement, and the vapor chamber for heat dissipation. This segmentation allows each component to perform its function efficiently while maintaining overall structural simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively cools heat sources using vapor chambers without reducing I/O openings, increasing design freedom and reducing manufacturing costs, while maintaining the simplicity of using only two fans in the heat dissipation assembly.
Implementation Method 1
Vapor chamber has been widely used for heat flux transformation due to the ability to transfer heat in two dimensions by being in a planar shape
Implementation Method 2
The vapor chamber is thermally coupled to the at least one first fin assembly and the at least one second fin assembly
Implementation Method 3
the cold air blown by the fan is unable to be effectively transferred to the vapor chamber
Implementation Method 4
The at least one first fin assembly is disposed adjacent to the at least one first outlet. The at least one second fin assembly is disposed adjacent to the at least one second outlet
Data Source
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AI summary
This disclosure provides a heat dissipation assembly (400) and an electronic device (10). The heat dissipation assembly includes a first fan (410), a first fin assembly (420), a second fan (430), a second fin assembly (440), a vapor chamber (450) and a heat dissipation sheet (460). The second fan has a second inlet (435), at least one second outlet (436) and a side outlet (437). The at least one second outlet and the side outlet are in fluid communication with the second inlet. A direction (A) of the side outlet directs toward the first fan. The vapor chamber is thermally coupled to the first fin assembly and the second fin assembly. The heat dissipation sheet is in thermal contact with a side of the vapor chamber, and located between the first fan and the second fan.