Laptop Stacked PCB Assembly for Easier Repair and Disassembly
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Solution Overview
Problem
Existing laptop computers face challenges in meeting sustainability criteria due to complex assembly processes, difficulty in disassembly, and potential electrical connection issues during assembly, which hinder repairability and regenerativity.
Innovation Solution
A laptop computer design that utilizes a stacked structure for electrical connections via combined circuit boards, allowing for intuitive assembly by overlapping semi-finished products, including a first casing, sub-circuit boards, and a bridge circuit board to simplify the assembly process and maintain electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional assembly methods (positioning and buckling of tenons or hooks, welding, screw locking, docking of connectors) are used to assemble laptop components, then structural connection is achieved, but assembly complexity increases and disassembly difficulty increases
Solution Approach 1:
The patent combines structural connection and electrical connection functions into a single integrated component. The connector simultaneously provides mechanical support (tenon structure) and electrical conductivity (conductive material), eliminating the need for separate connection elements and simplifying the assembly process while reducing overall device complexity
Solution Approach 2:
The connector is designed as a multi-functional component that performs both structural connection and electrical connection simultaneously. This universal design reduces the number of separate components needed, simplifies assembly procedures, and maintains reliable connections for both mechanical and electrical functions
2Reliability
If connectors and cables are used for electrical connections between members, then electrical connectivity is achieved, but wire management complexity increases and misconnection risks increase
Solution Approach 1:
The patent merges electrical connection and mechanical connection into a single integrated connector. The conductive material is built into the connector structure, eliminating separate cables and connectors, thereby simplifying wire management and reducing misconnection risks while maintaining reliable electrical connectivity
Solution Approach 2:
The patent extracts the electrical connection function from separate cables and connectors and integrates it directly into the mechanical connector structure. This extraction of the electrical connection function from separate components eliminates the complexity of wire management and reduces the risk of misconnection
3Ease of operation
If members are assembled with connectors and cables, then electrical connections are established, but connection ports become covered after stacking making disassembly difficult
Solution Approach 1:
The patent segments the connection interface into distinct regions: a mechanical connection portion (tenon) that remains accessible for disassembly and an electrical connection portion (conductive material) that is integrated within the connector. This segmentation allows the mechanical interface to remain accessible for easy disassembly while the electrical connection is maintained through the integrated conductive material
4Productivity
If complex electrical conducting members are used between electronic members, then electrical connectivity is achieved, but assembly time increases and production efficiency decreases
Solution Approach 1:
The patent combines electrical conducting members with mechanical connectors into a single integrated component. This merging eliminates the need for separate wiring steps and connector assembly, significantly reducing assembly time and improving productivity while maintaining reliable electrical connectivity through the integrated conductive material
Data Source
AI summary
A laptop computer including a first casing, a first sub-circuit board, an input module, a second casing, a motherboard, and a bridge circuit board is provided. The first sub-circuit board is disposed at the first casing. The input module is disposed at the first casing and electrically connected to the first sub-circuit board. The motherboard is disposed at the second casing. The first casing and the second casing are assembled together, such that the first sub-circuit board, the bridge circuit board, and the motherboard are partially overlapped, and the first sub-circuit board is electrically connected to the motherboard via the bridge circuit board.