Large Diameter Optical Waveguide Splice Using Multi-Laser Uniform Heating
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Solution Overview
Problem
Conventional optical waveguide fusion splicing techniques are limited to diameters of 400 um or less, making it challenging to achieve low-loss splices for larger diameter waveguides, and often require the use of epoxy, which introduces optical loss and environmental limitations.
Innovation Solution
The method involves aligning and fusing the distal ends of large diameter optical waveguide sections using multiple laser beams to ensure uniform heating and alignment, eliminating the need for epoxy by achieving a strong splice without it.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional single laser beam fusion splicing is used, then the splicing process is simple, but uniform heating cannot be achieved for large diameter waveguides greater than 400 um
Solution Approach 1:
The single laser beam is divided into multiple separate laser beams that are directed at different locations around the waveguide circumference. This segmentation allows each beam to heat a specific region, and collectively they provide uniform heating across the entire large diameter waveguide surface, resolving the contradiction between heating uniformity and system complexity.
Solution Approach 2:
The heating approach transitions from a single-point (one-dimensional) laser beam to a distributed multi-point (two-dimensional) arrangement of laser beams around the waveguide circumference. This dimensional change enables comprehensive coverage of the large diameter surface, achieving uniform heating that was impossible with a single beam.
2Reliability
If epoxy is used to attach fiber to large diameter devices, then alignment is simplified, but optical loss occurs and environmental limitations are imposed
Solution Approach 1:
The epoxy adhesive is completely removed from the splicing system. Instead of using epoxy to bond the fiber to the large diameter device, the invention uses laser fusion to directly fuse the glass materials together. This extraction of the harmful epoxy element eliminates both the optical loss and environmental limitations while maintaining strong mechanical bonding through the fusion process.
Solution Approach 2:
The chemical bonding mechanism of epoxy is replaced with a thermal fusion mechanism using laser beams. The laser-induced heating melts and fuses the glass materials directly, creating a strong mechanical bond without requiring any adhesive. This substitution eliminates the optical loss and environmental constraints associated with epoxy while achieving reliable mechanical strength.
3Loss of energy
If laser fusion is used for large diameter waveguides, then optical loss is reduced, but achieving uniform heating while maintaining core alignment becomes challenging
Solution Approach 1:
The heating process is segmented into multiple independent laser beams that can be individually controlled and positioned. This allows precise control of the heating zones while maintaining the overall alignment of the waveguide cores. The segmented approach enables uniform heating of the large diameter outer surfaces without compromising the precision alignment of the narrow inner cores.
Data Source
AI summary
Techniques and systems suitable for performing low-loss fusion splicing of optical waveguide sections are provided. According to some embodiments, multiple laser beams (from one or more laser) may be utilized to uniformly heat a splice region including portions of the optical waveguide sections to be spliced, which may have different cross-sectional dimensions. According to some embodiments, the relative distance of the optical waveguide sections and/or the power of the multiple laser beams may be varied during splicing operations.