Large Module Bonding via Vertical Conveyor Buffer
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Solution Overview
Problem
Existing bonding technologies for large modules, such as solar panels or battery modules, require extensive space due to the need for multiple processing steps and indexer systems, limiting flexibility and throughput, especially when handling modules of varying heights.
Innovation Solution
A method and arrangement where large modules are fed from behind into a loading plane, transported vertically into a bonding plane, and then unloaded from behind in a separate unloading plane, allowing for compact arrangement of bonders and increased throughput by integrating buffer positions within the bonder, using transverse and vertical conveyor units to manage module movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If indexer systems and buffer stations are arranged in one plane, then module feeding and removal can be organized, but a lot of space is required
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional spatial configuration by utilizing vertical stacking. Buffer stations are positioned at different heights (first buffer station at a first height, second buffer station at a second height), allowing multiple functional stations to occupy overlapping horizontal footprints while maintaining operational independence. This vertical dimensionality change dramatically reduces the horizontal space footprint of the bonding system.
2Area of moving object
If a large working area is provided for large modules, then module processing is enabled, but the space between bonders must be large
Solution Approach 1:
The patent employs vertical stacking of buffer stations at different heights to accommodate large module processing requirements without increasing horizontal spacing between bonders. The first and second buffer stations are positioned vertically, allowing the bonding system to handle large modules while maintaining a compact horizontal footprint and minimizing space requirements between adjacent bonders.
3Area of stationary object
If multiple buffer stations are positioned at different heights, then space is reduced, but module transfer complexity increases
Solution Approach 1:
The patent introduces a transfer mechanism that acts as an intermediary between buffer stations at different heights. This transfer mechanism facilitates smooth module movement between vertical levels, managing the complexity of multi-height positioning while enabling compact space utilization. The transfer mechanism serves as a mediator that coordinates the vertical module flow between buffer stations.
4Manufacturing precision
If indexing is repeated for large modules, then processing is completed, but production performance is low
Solution Approach 1:
The patent implements continuous module feeding and processing by positioning multiple buffer stations at different heights, enabling uninterrupted module supply to the bonding head. The vertical arrangement allows modules to be continuously fed from different buffer stations without idle indexing time, maintaining continuous productive action while completing necessary bonding operations for large modules.
Data Source
AI summary
A method for bonding large modules with the following steps, a large module is fed to a bonder from behind in a loading plane by means of a feeder unit. The large module is passed from the feeder unit to a first transverse conveyor unit, and is brought by the same to a first buffer position provided in the bonder, wherein the first buffer position is provided in a loading plane of the bonder. The large module is brought from the first buffer position into a first receiving position in the loading plane via the first transverse conveyor unit and is passed there to a vertical conveyor unit.