Laser-Ablated Thin Film Circuits for Planar Magnetic Transducers

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Solution Overview

Problem

Existing methods for manufacturing thin film circuits for acoustic transducers, such as chemical etching, face issues like mechanical and thermal failures, large impedance variations, low precision, environmental pollution, and inefficiencies, which affect the performance and reliability of planar magnetic transducers.

Innovation Solution

The use of laser ablation or delamination to create conductive circuits on a diaphragm substrate by selectively removing conductive material, allowing for precise control of trace dimensions to match the magnetic flux density and optimize performance characteristics, such as uniform force distribution and reduced impedance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If chemical etching is used to create conductive circuits, then the manufacturing process is simple, but the precision of trace dimensions is poor and environmental pollution occurs

Engineering Contradiction:
Improvetrace dimension precisionVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces chemical etching with laser ablation to create conductive circuits. The laser beam precisely removes conductive material layer by layer through controlled ablation, achieving superior trace dimension precision (widths down to 10 microns) without the environmental pollution and precision limitations of chemical etching processes.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the manufacturing parameter from chemical reaction-based etching to laser energy-based ablation. By controlling laser power, pulse duration, and scanning speed, the process achieves precise dimensional control of conductive traces while maintaining manufacturing feasibility through automated processing.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If conventional chemical etching is used, then production cost is low, but environmental pollution and reliability issues occur

Engineering Contradiction:
Improvecircuit reliabilityVSAvoidenvironmental pollution
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces chemical etching with laser ablation, eliminating the need for corrosive chemicals and their associated environmental pollution. The laser process creates clean, precise conductive circuits with superior reliability by directly ablatting material without chemical contamination or mechanical stress that could cause trace failures.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Power

If trace width is increased to reduce impedance, then current carrying capacity improves, but force distribution uniformity deteriorates

Engineering Contradiction:
Improvecurrent carrying capacityVSAvoidforce distribution uniformity
Core Design Contradiction:
PowerVSStability of the object's composition

Solution Approach 1:

The patent applies local quality by varying trace dimensions across different regions of the diaphragm. Traces are made narrower in high magnetic flux density areas and wider in low flux density areas, optimizing both current distribution and force uniformity. This localized dimension control allows the circuit to achieve excellent force distribution while maintaining adequate current carrying capacity through strategic dimensional variation.

Inventive Principle:
Principle #3Local quality

4Manufacturing precision

If laser ablation is used to create fine traces, then manufacturing precision improves, but device complexity increases

Engineering Contradiction:
Improvetrace width precisionVSAvoidmanufacturing equipment complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces complex chemical etching processes with laser ablation, which achieves superior precision (10 micron trace widths) through direct material removal. While laser equipment is sophisticated, the process eliminates multiple chemical handling steps, masking operations, and environmental control systems, potentially simplifying the overall manufacturing workflow despite the advanced laser technology required.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the creation of thin film circuits with finer trace widths and spacings, increasing efficiency and power density, allowing for uniform force distribution, higher output, and the ability to drive transducers with vacuum tubes, while reducing environmental impact and production costs.

Implementation Method 1

a laser is used to remove conductive material from the conductive layer to create the conductive circuit

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

The diaphragm in a planar magnetic transducer includes a conductive circuit pattern that, when energized, creates forces that move the diaphragm in the magnetic field to produce sound

Methodology Applied
Scientific EffectElectromagnetic force: Lorentz Force

Data Source

PatentEP3057719B1Thin film circuit for acoustic transducer and methods of manufacture
Publication Date: 2020.01.01 AUDEZE LLC
  • EP3057719B1 patent drawingFigure 1
  • EP3057719B1 patent drawingFigure 2
  • EP3057719B1 patent drawing

AI summary

A conductive circuit of a thin film for using in a planar magnetic transducer, where the conductive circuit is created from laser etching, including laser ablation or laser delamination of portions of a conductive material disposed on a diaphragm substrate. The conductive circuit so formed has varied widths, height, or spacing throughout the diaphragm, allowing for adaptation to certain desired performance characteristics. Performance characteristics include a uniform force distribution on the diaphragm, creating very high impedance circuits, increasing current in the circuit, increasing force, and increasing efficiency.