Laser-Ablated Patterned Substrate for Thin Beam Splitters

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing technologies for producing patterned substrates, such as e-beam lithography and nanoimprinting lithography, are complex, costly, and not suitable for fabricating multi-dimensional patterned surfaces. Additionally, conventional beam splitters are bulky and heavy, limiting their application in photonics integration and miniaturization.

Innovation Solution

A patterned substrate is created using laser-ablated areas on a substrate, arranged in a specific pattern, with each laser-ablated area containing a nanomaterial. The method involves laser-ablating the substrate to form patterns and then exposing it to a nanomaterial precursor to grow the nanomaterial within the laser-ablated areas, resulting in a patterned substrate with superior mechanical properties and optical transparency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional lithography techniques (e-beam, photolithography, nanoimprinting) are used to produce patterned substrates, then manufacturing precision can be achieved, but device complexity and production cost increase significantly

Engineering Contradiction:
Improvepattern fabrication precisionVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent extracts the patterning function from complex lithography systems by using direct laser writing to create patterns on the substrate. This eliminates the need for masks, aligners, and multiple lithography steps, achieving simple yet precise pattern fabrication through direct laser ablation and nanomaterial deposition

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces mechanical lithography systems with a laser-based system that uses optical fields to directly write patterns. The laser beam can be precisely controlled to deposit nanomaterials in desired patterns without mechanical contact or complex alignment mechanisms

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If conventional beam splitters are used, then beam splitting function is achieved, but weight and device size increase

Engineering Contradiction:
Improvebeam splitting functionVSAvoidbeam splitter weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The patent uses thin film substrates with laser-written nanomaterial patterns to create beam splitters. These thin-film-based beam splitters achieve the required optical functionality while being significantly lighter and thinner than conventional bulk beam splitter components

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent transitions from bulk 3D beam splitter components to 2D thin-film patterns on substrates. By confining the optical functionality to two-dimensional nanomaterial patterns, the device achieves beam splitting while minimizing weight and thickness

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Shape

If multi-dimensional patterned surfaces are fabricated using conventional techniques, then pattern complexity can be achieved, but manufacturing flexibility is limited

Engineering Contradiction:
Improvepattern dimensionalityVSAvoidmanufacturing flexibility
Core Design Contradiction:
ShapeVSAdaptability or versatility

Solution Approach 1:

The patent introduces dynamic control to the patterning process through programmable laser writing. The laser parameters (power, speed, scanning pattern) can be dynamically adjusted during fabrication, enabling flexible creation of various multi-dimensional patterns without changing physical masks or tools

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method allows for the production of patterned substrates that are optically transparent, have superior mechanical properties, and can be used for diffractive optical elements and beam splitters, enabling applications in extended reality devices and photonic integrated systems with a thinner and lighter profile.

Implementation Method 1

laser-ablating a substrate to form a pattern thereon including a plurality of laser-ablated areas, each laser-ablated area including a pit

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

thermally treating the laser-ablated substrate and a nanoparticle precursor to grow a nanomaterial in the pit of each laser-ablated area

Methodology Applied
Scientific EffectThermal treatment: Heat Treatment

Data Source

PatentUS20250155608A1Patterned substrate
Publication Date: 2025.05.15 CORNING INC
  • US20250155608A1 patent drawing
  • US20250155608A1 patent drawing
  • US20250155608A1 patent drawing

AI summary

A patterned substrate includes a substrate that includes a plurality of laser-ablated areas thereon arranged in the shape of a pattern. The laser-ablated areas each include a nanomaterial therein. Non-laser-ablated areas on the substrate have a lower concentration of the nanomaterial than the laser-ablated areas.