Laser Ablation Microscopy for Flat-Layer 3D Semiconductor Imaging

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing methods for obtaining high-resolution 3D images of semiconductor materials face challenges such as low throughput, distortion due to non-flat layer assumptions, and material integrity issues, particularly in laser ablation and mechanical delayering techniques.

Innovation Solution

A system and method combining femtosecond laser ablation with optical and confocal microscopy to achieve high-resolution 3D imaging by using a confocal height sensor for precise layering and a mask to ensure flat surfaces, integrating a CO2 nozzle for debris removal, and a controller for synchronized laser and imaging processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional laser ablation is used for delayering, then material removal speed is improved, but layer flatness deteriorates due to different ablation rates of different materials

Engineering Contradiction:

Improvematerial removal speedVSAvoidlayer flatness

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The system uses confocal microscopy to measure the actual surface topography after each ablation step, then feeds this information back to adjust the laser parameters or stage positioning for the next ablation step, maintaining layer flatness while achieving high removal speeds

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The laser ablation parameters (power, pulse duration, scanning speed) are dynamically adjusted based on the material composition detected at different locations, allowing high-speed ablation of conductive materials while preserving the flatness required for subsequent imaging of insulating materials

Inventive Principle:

Principle #35Parameter changes

2Productivity

If mechanical delayering methods are used, then throughput is improved, but sample integrity deteriorates due to thermal and mechanical stress

Engineering Contradiction:

Improvedelayering throughputVSAvoidsample integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent replaces mechanical delayering methods (grinding, polishing) with laser ablation, which removes material through controlled vaporization without contact, thereby eliminating mechanical stress and thermal conduction issues while maintaining high throughput through automated scanning

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Measurement precision

If FIB delayering is used, then imaging resolution is improved, but throughput deteriorates to the point where only tiny regions can be analyzed

Engineering Contradiction:

Improveimaging resolutionVSAvoidanalysis throughput

Core Design Contradiction:

Measurement precisionVSProductivity

Solution Approach 1:

The system divides the sample into multiple layers and processes them sequentially through automated delayering and imaging cycles, enabling high-resolution imaging of large regions by accumulating data from many thin layers rather than attempting to image the entire volume at once

Inventive Principle:

Principle #1Segmentation

4Productivity

If high current or plasma source FIB is used, then delayering speed is improved, but resolution deteriorates and processing still takes days for cubic millimeters

Engineering Contradiction:

Improvedelayering speedVSAvoidimaging resolution

Core Design Contradiction:

ProductivityVSMeasurement precision

Solution Approach 1:

The system uses confocal microscopy as an intermediary measurement tool to monitor layer formation in real-time during laser delayering, enabling precise control of layer thickness and flatness without relying on high-current FIB, thus achieving both speed and resolution

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables fast, accurate, and cost-effective high-resolution 3D imaging with minimal sample distortion and integrity preservation, allowing for detailed inspections and reverse engineering of semiconductor materials.

Implementation Method 1

laser ablation and microscopy... femtosecond laser ablation is used for delayering the samples

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

optical and confocal microscopy to address the challenges of obtaining adequate flat layers during the laser ablation process

Methodology Applied

Scientific EffectConfocal microscopy:

Data Source

PatentUS12548219B2System and method for high-resolution 3D images using laser ablation and microscopy

Publication Date: 2026.02.10 AEROCYONICS IMAGING LLC

AI summary

A system and method for generating a three-dimensional image of a sample. The system comprises a platform configured to support the sample, a laser source configured to output a laser beam to remove material from the sample, a microscope imaging system, and a controller communicatively coupled to the laser source and the microscope imaging system. The controller is configured to (a) acquire height data of a surface of the sample with the microscope imaging system, (b) generate a mask based on the height data of the surface of the sample, the mask providing a laser cutting pattern for the sample, (c) acquire an image and a height map of the surface of the sample with the microscope imaging system, (d) activate the laser source to generate a laser beam to delayer the sample based on the mask, and repeat steps (a)-(d) to generate a three-dimensional image of the sample.