Laser Ablation for Cutting Insert T-Land Surface Creation

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Solution Overview

Problem

Conventional grinding techniques for cutting inserts, such as those made of cubic boron nitride or polycrystalline diamond, suffer from low material removal rates and compromised surface integrity due to the inability of composite grinding wheels to effectively remove material without damaging the substrate.

Innovation Solution

A method utilizing a focused laser beam produced by electromagnetic radiation, passed through a homogenizer and mask to achieve uniform energy density and selective material removal, allowing for precise adjustment of material removal by changing the mask's shape, eliminating physical contact and stress on the cutting insert.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a grinding wheel is used to remove material from the cutting insert, then material removal is achieved, but the material removal rate is meager and surface integrity is compromised

Engineering Contradiction:
Improvematerial removal rateVSAvoidsurface integrity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces the mechanical grinding system with an electromagnetic radiation-based ablation system. A laser beam is focused onto the cutting insert surface to remove material through photothermal ablation, eliminating the need for physical contact between the grinding wheel and the workpiece. This substitution resolves the contradiction by achieving high material removal rates without compromising surface integrity, as the laser can precisely ablate material without the mechanical stresses and vibrations inherent in grinding processes

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental parameter of material removal from mechanical force-based (grinding) to energy-based (laser ablation). By controlling laser parameters such as power, pulse duration, and focal spot size, the process achieves controlled material removal with high precision. The laser parameters can be adjusted to optimize both material removal rate and surface quality, resolving the trade-off between productivity and manufacturing precision

Inventive Principle:
Principle #35Parameter changes

2Quantity of substance

If a grinding wheel with mesh size of 400-1800 grit is used, then material can be removed, but PCD or CBN particulates are removed from the matrix creating voids

Engineering Contradiction:
Improvematerial removalVSAvoidsurface integrity
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The laser ablation process replaces mechanical grinding, eliminating the problem of particulate removal. The laser beam selectively vaporizes or ablates material through controlled heating, removing material in a controlled manner without mechanically dislodging bonded particulates. This preserves the integrity of the PCD or CBN particulates embedded in the matrix while achieving effective material removal

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The laser ablation process utilizes phase transitions (from solid to vapor or plasma) to remove material. The focused laser energy rapidly heats the material to temperatures sufficient for vaporization or ablation, removing material through phase change rather than mechanical force. This phase transition mechanism allows precise material removal without the mechanical stresses that cause particulate detachment and void formation in grinding processes

Inventive Principle:
Principle #36Phase transitions

3Productivity

If conventional grinding techniques are used on hard-coated inserts, then material removal is achieved, but the process is time-consuming and inefficient

Engineering Contradiction:
Improvematerial removal rateVSAvoidprocessing time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The patent replaces slow mechanical grinding with rapid laser ablation. The laser beam can remove material at significantly higher rates due to the direct energy-to-material conversion through ablation. The process eliminates the need for progressive grit removal and material displacement associated with grinding, achieving rapid material removal without the time-consuming nature of conventional grinding techniques

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The laser ablation process can be performed using pulsed laser operation, where periodic pulses of laser energy are delivered to the workpiece. This periodic action allows for controlled material removal with minimal heat accumulation, enabling high material removal rates while maintaining precision and avoiding thermal damage. The pulsed regime optimizes both productivity and processing efficiency

Inventive Principle:
Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly enhances material removal rates and quality, enabling the creation of precise surface features like T-land surfaces without compromising the cutting insert's surface integrity, suitable for hard-coated and uncoated inserts.

Implementation Method 1

focusing a source of electromagnetic radiation onto a surface of the cutting insert

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

focusing a laser beam onto a surface of the cutting insert, thereby creating a surface feature on the surface of the cutting insert

Methodology Applied
Scientific EffectAbsorption of electromagnetic radiation: Absorption (EM radiation)

Data Source

PatentUS10730146B2Method and apparatus for removing material from a cutting insert using electromagnetic radiation
Publication Date: 2020.08.04 KENNAMETAL INDIA
  • US10730146B2 patent drawing
  • US10730146B2 patent drawing
  • US10730146B2 patent drawing

AI summary

A method and apparatus for removing material from a cutting insert is disclosed. A source of electromagnetic radiation produces a laser beam that passes through a aperture for truncating a dimension of the laser beam and a homogenizer for providing a cross section of the laser beam with a uniform energy density. A mask having a predetermined shape reduces the dimension of the laser beam, and an imaging lens projects the laser beam onto a surface of the cutting insert. The predetermined shape of the mask provides for selective adjustment of an amount of material removed from the surface of the cutting insert. In one embodiment, the mask has a shape of an isosceles trapezoid for producing a T-land surface at the intersection between a top rake face and the flank face of the cutting insert.