Laser Ablation Nanoparticle Application via Liquid Intermediary
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Solution Overview
Problem
Existing methods for applying metallic nanoparticles to substrates, such as vapor deposition, result in material loss and health risks due to toxicity and inhalation hazards, and lack efficient uniformity and adhesion.
Innovation Solution
A system utilizing laser ablation in a curable polymer liquid to generate and apply nanoparticles, ensuring minimal material loss and improved adhesion, where nanoparticles are removed from metal or semiconductor parts and evenly distributed within the liquid for precise application to substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vapor deposition is used to apply metallic nanoparticles, then metallic conductor tracks can be formed on substrates, but material is lost and health risks arise from toxic metal fumes and inhalation hazards
Solution Approach 1:
The patent uses liquid as an intermediary medium to carry nanoparticles from the metal part to the substrate. Instead of direct vapor deposition, nanoparticles are removed in liquid, transported with the liquid flow, and applied to the substrate, eliminating direct contact with toxic metal vapors and reducing material loss.
Solution Approach 2:
The patent replaces the thermal/vapor deposition process with a liquid-based mechanical transport system. A pump circulates liquid through a reduced-diameter passage where nanoparticles are removed and applied to the substrate, substituting the vapor-phase physical process with a liquid-phase mechanical flow system.
2Reliability
If vapor deposition is used to apply metallic nanoparticles, then conductor tracks can be formed, but uniformity and adhesion are insufficient
Solution Approach 1:
The patent employs hydraulic flow through a reduced-diameter passage to transport nanoparticles uniformly. The liquid flow mechanism ensures even distribution of nanoparticles across the substrate surface, improving uniformity and adhesion compared to vapor deposition methods.
3Quantity of substance
If nanoparticles are removed from metal parts without liquid, then material can be transferred, but nanoparticles fly around freely causing loss and contamination
Solution Approach 1:
Liquid serves as the intermediary that captures and transports nanoparticles. Instead of free-flying particles, the liquid medium holds nanoparticles in suspension, directing them to the substrate while preventing loss and contamination through contained liquid flow.
Solution Approach 2:
The liquid creates a controlled environment for nanoparticle transport. Within the liquid phase, nanoparticles are contained and protected from external contamination, while the liquid itself acts as a barrier preventing particles from escaping into the surrounding atmosphere.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes material loss and health risks, provides uniform nanoparticle distribution, and ensures strong adhesion for subsequent components, facilitating efficient and safe application of conductive metals like gold, silver, and copper in photolithography processes.
Implementation Method 1
A laser with a scanning system 13 is arranged above the chamber 14. The laser beam 12 is directed through the glass plate of the chamber 14 onto the metal or semiconductor part 8. Metal particles (nanoparticles) are removed from the surface of the metal or semiconductor part 8 with the laser beam 12.
Implementation Method 2
The polymer mass is conveyed with a pump 17 through a line 18 in the direction of the arrows.
Implementation Method 3
The flow generating means may also include an ultrasonic hammer which forces the liquid through a reduced diameter passage.
Data Source
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Figure 2
AI summary
An arrangement for applying metal nanoparticles onto a wafer or another substrate, is characterized by a metal or semiconductor part arranged in a liquid reservoir; a laser or particle emitter for removing nanoparticles from the metal or semiconductor part in the liquid inside the liquid reservoir; and means for applying the removed metal particle-containing liquid onto the substrate.