Laser Ablation Processing for Reconfigurable Optoelectronic Components
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Solution Overview
Problem
Current methods for making components for electronic and optical devices require large-scale clean rooms and are not easily reconfigurable, limiting rapid device prototyping and design evolution, and are limited to producing single-function components that need assembly for desired functionality.
Innovation Solution
A laser-based process for introducing chemical and structural changes in substrates and films to create components with integrated electronic and optical functionalities, allowing for rapid prototyping and design changes without the need for large-scale facilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If current manufacturing methods are used, then components can be produced with established processes, but large-scale clean rooms are required and reconfigurability is limited
Solution Approach 1:
The patent replaces traditional mechanical manufacturing processes (photolithography, etching, deposition) with a laser-based system that uses optical fields to directly modify materials. The laser system can write circuit patterns, create vias, and form components through ablation and thermal processing, eliminating the need for complex clean room equipment and enabling easy reconfiguration by simply changing laser programming.
Solution Approach 2:
The laser processing system performs multiple manufacturing functions using a single tool: it can create conductive traces, insulating structures, vias, and integrated components through different laser parameters (pulse duration, power, wavelength). This multi-functional approach replaces multiple specialized manufacturing tools and processes, enabling both simplicity and adaptability.
2Ease of manufacture
If traditional assembly methods are used, then single function components can be manufactured, but integration of multiple functions requires assembly of separate components
Solution Approach 1:
The patent merges multiple manufacturing operations into a single laser processing step. The laser can simultaneously or sequentially create conductive paths, insulating barriers, and functional structures within the same substrate, integrating multiple component functions into a single monolithic structure rather than requiring assembly of separate components.
Solution Approach 2:
The laser processing enables three-dimensional integration within the substrate by controlling ablation depth and thermal diffusion. Multiple functional layers and structures can be created at different depths and positions within the same material volume, allowing complex multi-functional integration without increasing planar footprint or assembly complexity.
3Adaptability or versatility
If additive manufacturing is used, then reconfigurability improves, but reproducibility and material stability remain problematic
Solution Approach 1:
The laser processing system achieves reproducibility through precise control of laser parameters (power, pulse duration, scanning speed, wavelength) and material properties. By establishing standardized processing parameters for different materials and geometries, the system ensures consistent, repeatable results while maintaining the ability to reconfigure designs through software programming rather than physical retooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of components with multiple functionalities on a single substrate, facilitating easy reconfiguration and rapid device development.
Implementation Method 1
uses a laser to introduce chemical and/or structural changes and/or removal of material through ablation or similar laser removal processes in substrates and films
Implementation Method 2
could also be used to induce chemical and/or structural changes in substrates and films with distinct electronic properties
Implementation Method 3
could also be used to induce chemical and/or structural changes in substrates and films with distinct electronic properties
Data Source
AI summary
The present invention relates to processes of making components for electronic and optical devices using laser processing and devices comprising such components. Such process uses a laser to introduce chemical and/or structural changes in substrates and films that are the raw materials from which components for electronic and optical devices are made. Such process yields components that can have one or more electronic and/or optical functionalities that are integrated on the same substrate or film. In addition, such process does not require large-scale clean rooms and is easily configurable. Thus, rapid device prototyping, design change and evolution in the lab and on the production side is realized.