Laser Ablation for TFT Pixel Structure Fabrication

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Solution Overview

Problem

The conventional method for fabricating pixel structures in TFT-LCDs requires multiple expensive photolithography and etching processes, leading to high fabrication costs, especially as the size of the panels increases, due to the need for various photo-masks and complex processes.

Innovation Solution

The method employs a laser ablation process using shadow masks to form each film layer of the pixel structure, reducing the need for expensive photolithography and etching processes and simplifying the fabrication steps, with the laser beam's energy and position adjusted digitally for precision.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple photolithography and etching processes are used to fabricate pixel structures, then manufacturing precision is improved, but fabrication cost increases

Engineering Contradiction:
Improvepixel structure fabrication precisionVSAvoidfabrication cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces the conventional photolithography and etching processes with a laser ablation process. The laser beam systematically removes material layer by layer to form pixel structures, eliminating the need for multiple photo-masks and chemical etching steps. This substitution of mechanical/chemical processes with a laser-based process reduces fabrication cost while maintaining manufacturing precision.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the processing parameters from conventional photolithography (using photo-masks, photoresist, and chemical etchants) to laser ablation (using laser beam parameters such as power, pulse duration, and scanning speed). By adjusting laser parameters, the same manufacturing precision can be achieved without the need for expensive multiple photo-masks and complex chemical processes.

Inventive Principle:
Principle #35Parameter changes

2Area of stationary object

If the size of TFT-LCD panel is increased, then display area is improved, but fabrication cost increases due to larger photo-masks

Engineering Contradiction:
Improvedisplay areaVSAvoidfabrication cost
Core Design Contradiction:
Area of stationary objectVSEase of manufacture

Solution Approach 1:

The laser ablation process eliminates the need for large physical photo-masks required in conventional photolithography for large panels. The laser beam can be digitally controlled to pattern large areas without requiring proportionally larger and more expensive photo-masks, thus reducing the cost increase associated with larger display areas.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The laser ablation system serves multiple functions: it can pattern different pixel structures, adjust to different panel sizes, and modify patterns through digital control without requiring physical mask changes. This universality allows the same equipment and process to efficiently manufacture various panel sizes without proportionally increasing fabrication cost.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Manufacturing precision

If multiple photo-masks are used for different patterns, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:
Improvepattern fabrication precisionVSAvoidfabrication process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces the complex sequence of multiple photolithography and etching processes with a single laser ablation process. The laser system with digital control can sequentially or simultaneously create different patterns without requiring multiple photo-masks, alignment steps, and chemical processing stages, thereby reducing fabrication process complexity while maintaining pattern precision.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts and removes the unnecessary photo-masks and photoresist steps from the fabrication process. By using laser ablation directly on the deposited layers, the process eliminates intermediate materials and steps, simplifying the overall fabrication process while maintaining the ability to create precise patterns.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly lowers the fabrication cost by eliminating the need for multiple photo-masks and complex processes, reducing defects, and allowing for more efficient production with the ability to repair pixel structures, such as fixing short circuits, thereby improving production yield.

Implementation Method 1

the first conductive layer is irradiated by a laser beam through the first shadow mask, so as to remove the portion of the first conductive layer exposed by the first shadow mask to form a gate electrode

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

The semiconductor layer is irradiated by a laser beam through the second shadow mask, so as to remove the portion of the semiconductor layer exposed by the second shadow mask to form a channel layer

Methodology Applied
Scientific EffectAblation: Ablation

Data Source

PatentUS7682884B2Method for fabricating pixel structure
Publication Date: 2010.03.23 AU OPTRONICS CORP
  • US7682884B2 patent drawing
  • US7682884B2 patent drawing
  • US7682884B2 patent drawing

AI summary

A method for fabricating a pixel structure using a laser ablation process is provided. This fabrication method forms a gate, a channel layer, a source, a drain, a passivation layer, and a pixel electrode sequentially by using a laser ablation process. Particularly, the fabrication method is not similar to a photolithography and etching process, so as to reduce the complicated photolithography and etching processes, such as spin coating process, soft-bake, hard-bake, exposure, developing, etching, and stripping. Therefore, the fabrication method simplifies the process and thus reduces the fabrication cost.