Through Via Fabrication Using Laser Ablation and Release Layer
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Solution Overview
Problem
Current methods for fabricating through via glass substrates are time-consuming and consume significant polishing materials, increasing the risk of substrate cracking and material waste.
Innovation Solution
A method involving a carrier board with a release layer, where a high-energy light beam forms a blind hole in the substrate, followed by enlargement and metallization, allowing for de-bonding without chemical mechanical polishing, thereby reducing process time and material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If chemical mechanical polishing is used to form through via, then through via can be formed, but process time is extended and polishing consumables are consumed
Solution Approach 1:
The patent performs preliminary actions by forming a blind hole that penetrates both surfaces of the substrate before the final through via formation. The blind hole is then enlarged and processed to create the through via, eliminating the need for time-consuming chemical mechanical polishing while maintaining via quality
Solution Approach 2:
The patent extracts the chemical mechanical polishing step from the fabrication process entirely. By using alternative methods (blind hole formation followed by enlargement and metallization), the polishing operation is removed, reducing both time and consumable usage while achieving the same through via formation goal
2Manufacturing precision
If chemical mechanical polishing is used to form through via, then through via can be formed, but polishing consumables are consumed
Solution Approach 1:
The patent extracts the chemical mechanical polishing step from the fabrication process entirely. By using alternative methods (blind hole formation followed by enlargement and metallization), the polishing operation is removed, reducing both time and consumable usage while achieving the same through via formation goal
Solution Approach 2:
The patent uses a carrier board with a release layer that can be easily removed after the process. This disposable carrier system eliminates the need for expensive and consumable polishing materials, as the carrier board is discarded after serving its purpose of supporting the substrate during fabrication
3Manufacturing precision
If conventional through via process is used, then through via can be formed, but risk of substrate cracking increases
Solution Approach 1:
The substrate is attached to a carrier board before the via formation process. This preliminary action provides mechanical support and stress distribution during blind hole formation, enlargement, and metallization, preventing substrate cracking while maintaining via formation quality
Solution Approach 2:
The carrier board with release layer serves as a cushioning support structure that absorbs and distributes mechanical stresses during the fabrication process. This beforehand cushioning prevents stress concentration that would otherwise cause substrate cracking, ensuring substrate integrity throughout the process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method accelerates the fabrication process, reduces substrate cracking risk, and minimizes material consumption, resulting in a high-quality through via substrate with reduced costs.
Implementation Method 1
applying a high-energy light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate
Data Source
AI summary
A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.