Laser-Activated Mold Compound for Double-Sided Cooled Semiconductor Packages
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Solution Overview
Problem
Molded semiconductor packages face challenges in achieving improved thermal performance and scalability due to the complexity and cost associated with metal clip designs, particularly for double-sided cooling, which increases manufacturing line complexity and overall package cost.
Innovation Solution
A method involving a semiconductor die encapsulated in a laser-activatable mold compound, where the leadframe is partly exposed and laser-activated regions form electrical connections, eliminating the need for metal clips and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal clips are used to enhance thermal performance, then thermal performance is improved, but manufacturing line complexity increases due to high number of clip design requirements for various chip sizes
Solution Approach 1:
The patent uses a universal mold compound material that can serve multiple functions: encapsulation, thermal management, and electrical connection formation. This single material replaces the need for separate metal clips with different designs for various chip sizes, thereby improving thermal performance while reducing manufacturing line complexity
Solution Approach 2:
The patent changes the physical and chemical parameters of the mold compound by incorporating laser-activatable components and conductive fillers. This allows the mold compound to be selectively activated and plated to form electrical connections, eliminating the need for multiple metal clip designs while maintaining thermal performance
2Reliability
If metal clips are used for electrical connections, then electrical connectivity is achieved, but package cost increases due to etching process costs
Solution Approach 1:
The patent merges the functions of the mold compound, thermal management material, and electrical connection substrate into a single integrated component. The mold compound is formulated with conductive fillers and laser-activatable properties, allowing it to serve as both the encapsulation material and the base for electrical connections, thereby eliminating the need for separate metal clips and reducing package cost
Solution Approach 2:
The patent replaces the mechanical metal clip system with a chemically formulated mold compound system. Instead of using metal clips that require etching and mechanical assembly, the invention uses a mold compound that can be laser-activated and plated to form electrical connections, simplifying the manufacturing process and reducing costs
3Ease of manufacture
If stamped metal clips are used to reduce cost, then package cost decreases, but production volume requirements increase to justify tooling investment
Solution Approach 1:
The patent enables the mold compound to self-form the electrical connection structures through laser activation and plating. The mold compound contains the necessary conductive fillers and reactive components that allow it to be selectively activated and plated to form electrical connections, eliminating the need for expensive stamped metal clip tooling and allowing cost-effective production at lower volumes
4Temperature
If double-sided cooling is implemented, then thermal performance is improved, but manufacturing line complexity increases due to additional processes needed to expose metal clips
Solution Approach 1:
The patent uses a universal mold compound that serves as both the encapsulation material and the electrical connection substrate on both sides of the package. The same material formulation and laser activation process can be applied to both sides, enabling double-sided cooling and electrical connections without requiring different processes for each side, thereby reducing manufacturing line complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal performance and scalability while reducing production costs by using laser-activated regions for electrical connections, allowing for efficient production and accommodating various chip sizes without requiring multiple clip designs.
Implementation Method 1
laser activating a first region of the laser-activatable mold compound to form a first laser-activated region which forms part of an electrical connection to the second load terminal
Data Source
AI summary
A method of producing a molded semiconductor package includes: attaching a first load terminal at a first side of a semiconductor die to a leadframe, the semiconductor die having a second load terminal at a second side opposite the first side and a control terminal at the first side or the second side; encapsulating the semiconductor die in a laser-activatable mold compound so that the leadframe is at least partly exposed from the laser-activatable mold compound at a first side of the molded semiconductor package, and the second load terminal is at least partly exposed from the laser-activatable mold compound at a second side of the molded semiconductor package opposite the first side; and laser activating a first region of the laser-activatable mold compound to form a first laser-activated region that is electrically conductive.